Patents by Inventor Joshua C. Myers

Joshua C. Myers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11658378
    Abstract: Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: May 23, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joshua C. Myers, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi, Wiren D. Becker, Sungjun Chun, Daniel M. Dreps
  • Patent number: 11399428
    Abstract: A printed circuit board (‘PCB’) including a substrate integrated waveguide (‘SIW’) formed using two ground planes representing the top and bottom walls of the waveguide, tightly pitched ground vias to act as two side walls and two back walls, and a pair of monopole antennas placed at each end of the SIW acting as signal feeding/receiving structures is disclosed. The waveguide dominant mode cut off frequency is determined by the spacing between the two side walls. Within each monopole antenna pair, the first monopole antenna operates at a first frequency while the second monopole antenna operates at another frequency. For each monopole antenna pair, the first monopole antenna and the second monopole antenna are located in the SIW at a distance from the back wall optimal for each operating frequency.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: July 26, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Pavel Roy Paladhi, Jose A. Hejase, Junyan Tang, Joshua C. Myers, Sungjun Chun, Wiren D. Becker, Daniel M. Dreps
  • Publication number: 20210112655
    Abstract: A printed circuit board (‘PCB’) including a substrate integrated waveguide (‘SIW’) formed using two ground planes representing the top and bottom walls of the waveguide, tightly pitched ground vias to act as two side walls and two back walls, and a pair of monopole antennas placed at each end of the SIW acting as signal feeding/receiving structures is disclosed. The waveguide dominant mode cut off frequency is determined by the spacing between the two side walls. Within each monopole antenna pair, the first monopole antenna operates at a first frequency while the second monopole antenna operates at another frequency. For each monopole antenna pair, the first monopole antenna and the second monopole antenna are located in the SIW at a distance from the back wall optimal for each operating frequency.
    Type: Application
    Filed: October 14, 2019
    Publication date: April 15, 2021
    Inventors: Pavel ROY PALADHI, Jose A. Hejase, Junyan Tang, Joshua C. Myers, Sungjun Chun, Wiren D. Becker, Daniel M. Dreps
  • Publication number: 20210111472
    Abstract: Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.
    Type: Application
    Filed: October 14, 2019
    Publication date: April 15, 2021
    Inventors: JOSHUA C. MYERS, JOSE A. HEJASE, JUNYAN TANG, PAVEL ROY PALADHI, WIREN D. BECKER, SUNGJUN CHUN, DANIEL M. DREPS
  • Patent number: 10199706
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: February 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Samuel R. Connor, Daniel M. Dreps, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers, Junyan Tang
  • Patent number: 10181628
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: January 15, 2019
    Assignee: International Business Machines Corporation
    Inventors: Daniel M. Dreps, Jose A. Hejase, Joshua C. Myers, Junyan Tang
  • Patent number: 10141623
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide coupled at respective ends to coaxial vias. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core. The coaxial vias include a center conductor and an outer conductor (or shield) which extend through one or more layers of the PCB. One of the coaxial vias radiates electromagnetic signals into the dielectric waveguide at a first end of the core while the other coaxial via receives the radiated signals at a second end of the core.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: November 27, 2018
    Assignee: International Business Machines Corporation
    Inventors: Samuel R. Connor, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers, Junyan Tang
  • Publication number: 20180115043
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
    Type: Application
    Filed: October 21, 2016
    Publication date: April 26, 2018
    Inventors: Daniel M. DREPS, Jose A. HEJASE, Joshua C. MYERS, Junyan TANG
  • Publication number: 20180115042
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
    Type: Application
    Filed: October 21, 2016
    Publication date: April 26, 2018
    Inventors: Samuel R. CONNOR, Daniel M. DREPS, Jose A. HEJASE, Joseph KUCZYNSKI, Joshua C. MYERS, Junyan TANG
  • Publication number: 20180108971
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide coupled at respective ends to coaxial vias. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core. The coaxial vias include a center conductor and an outer conductor (or shield) which extend through one or more layers of the PCB. One of the coaxial vias radiates electromagnetic signals into the dielectric waveguide at a first end of the core while the other coaxial via receives the radiated signals at a second end of the core.
    Type: Application
    Filed: October 17, 2016
    Publication date: April 19, 2018
    Inventors: Samuel R. CONNOR, Jose A. HEJASE, Joseph KUCZYNSKI, Joshua C. Myers, Junyan TANG