Patents by Inventor Joshua Chiang

Joshua Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electric insulating prepreg applied to fuel cell
    Publication number: 20070184255
    Abstract: A prepreg for fuel cell obtained by soaking reinforcing glass fiber cloth in resin mixture and having the soaked cloth pre-dried to form incompletely cured prepreg which can be press-cured under temperature range of 60?˜200? to provide good mechanical and electrical property and high bonding strength, and when applied to fuel cell for bonding together the parts and components of the fuel cell the prepreg can also provide the effect of preventing crossover of fuel of the fuel cell and helping to the normal operation of the fuel cell.
    Type: Application
    Filed: February 2, 2007
    Publication date: August 9, 2007
    Applicants: NAN YA PLASTICS CORPORATION, NAN YA PRINTED CIRCUIT BOARD CORPORATION
    Inventors: Joshua Chiang, Ming-Tung Lin, Chih-Ming Chang, Pi-Feng Chang, Shi-Shyan Shang, Ching-Sen Yang
  • Epoxy/clay nanocomposite for making printed circuit boards
    Patent number: 6548159
    Abstract: An epoxy/clay nanocomposite suitable for use as matrix material for printed circuit boards is disclosed. The nanocomposite of the present invention comprises a layered clay material uniformly dispersed in an epoxy polymer matrix, wherein the clay material has been modified to an organoclay by ion exchange with (1) benzalkonium chloride and (2) dicyandiamide or tetraethylenepentamine. The epoxy/clay nanocomposites of the present invention have superior dimensional and thermal stability, and a lower hygroscopic property. The invention also includes the prepregs or circuit boards containing the epoxy/clay nanocomposite.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: April 15, 2003
    Assignees: Industrial Technology Research Institute, Nan Ya Plastics Corporation
    Inventors: Tsung-Yen Tsai, Sung-Jeng Jong, An-Chi Yeh, Joshua Chiang, Bor-Ren Fang
  • Epoxy/clay nanocomposite for making printed circuit boards
    Publication number: 20030039812
    Abstract: An epoxy/clay nanocomposite suitable for use as matrix material for printed circuit boards is disclosed. The nanocomposite of the present invention comprises a layered clay material uniformly dispersed in an epoxy polymer matrix, wherein the clay material has been modified to an organoclay by ion exchange with (1) benzalkonium chloride and (2) dicyandiamide or tetraethylenepentamine. The epoxy/clay nanocomposites of the present invention have superior dimensional and thermal stability, and a lower hygroscopic property. The invention also includes the prepregs or circuit boards containing the epoxy/clay nanocomposite.
    Type: Application
    Filed: November 13, 2001
    Publication date: February 27, 2003
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, NAN YA PLASTICS CORPORATION
    Inventors: Tsung-Yen Tsai, Sung-Jeng Jong, An-Chi Yeh, Joshua Chiang, Bor-Ren Fang