Patents by Inventor Joshua Dech

Joshua Dech has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method of dielectric bonding
    Patent number: 11987033
    Abstract: A system and method for dielectric bonding including a dielectric heater having a pair of opposing electrode plates, a nest removably coupled to a first electrode plate of the pair of electrode plates, and an interchangeable electrode assembly removably coupled to a second electrode plate of the pair of electrode plates. The nest having a plurality of cooling channels defined in a body thereof in which a cooling fluid circulates to cool a material assembly that is supported by the nest. The interchangeable electrode assembly having a plurality of concentrator members that are configured to concentrate energy from a voltage source in predetermined locations on the material assembly.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: May 21, 2024
    Assignee: Teijin Automotive Technologies, Inc.
    Inventors: Hugh Foran, Noriyuki Amano, Joshua Dech
  • SYSTEM AND METHOD OF DIELECTRIC BONDING
    Publication number: 20230074158
    Abstract: A system and method for dielectric bonding including a dielectric heater having a pair of opposing electrode plates, a nest removably coupled to a first electrode plate of the pair of electrode plates, and an interchangeable electrode assembly removably coupled to a second electrode plate of the pair of electrode plates. The nest having a plurality of cooling channels defined in a body thereof in which a cooling fluid circulates to cool a material assembly that is supported by the nest. The interchangeable electrode assembly having a plurality of concentrator members that are configured to concentrate energy from a voltage source in predetermined locations on the material assembly.
    Type: Application
    Filed: August 26, 2022
    Publication date: March 9, 2023
    Applicant: Teijin Automotive Technologies, Inc.
    Inventors: Hugh Foran, Noriyuki Amano, Joshua Dech