Abstract: A vibration isolator and method of assembly utilize “flex circuits” to provide both vibration/shock isolation and integrated electrically isolated conductive paths to support lightweight devices (<100 grams) such as crystal oscillators, IC chips, MEMs devices and the like. Each flex circuit includes a least one polymer layer and at least one of the flex circuits includes at least one patterned conductive layer. The isolator may be integrally formed from a stack of polymer layers and patterned conductive layers to provide the plurality of flex circuits, platform and connectors. Most typically, flex circuits are Type 4 in which the multiple polymer layers have a loose leaf or bonded configuration. Flex circuits are easy to produce in large quantities at low cost with standardized and repeatable performance characteristics.

Abstract: A vibration isolator and method of assembly utilize “flex circuits” to provide both vibration/shock isolation and integrated electrically isolated conductive paths to support lightweight devices (<100 grams) such as crystal oscillators, IC chips, MEMs devices and the like. Each flex circuit includes a least one polymer layer and at least one of the flex circuits includes at least one patterned conductive layer. The isolator may be integrally formed from a stack of polymer layers and patterned conductive layers to provide the plurality of flex circuits, platform and connectors. Most typically, flex circuits are Type 4 in which the multiple polymer layers have a loose leaf or bonded configuration. Flex circuits are easy to produce in large quantities at low cost with standardized and repeatable performance characteristics.

Abstract: A system includes a payload ejector configured to contact a payload carried by a flight vehicle and to push the payload away from the flight vehicle. The payload ejector includes a piston configured to extend from the payload ejector and a shock attenuator coupled to the piston, where the shock attenuator is configured to push the payload away from the flight vehicle. The shock attenuator includes a shock attenuator housing and a plunger that is movable within the shock attenuator housing and that extends from the shock attenuator housing. The plunger is configured to be pushed at least partially into the shock attenuator housing in order to damp a shock pulse applied to the payload. The shock attenuator housing may have an interior space, and the shock attenuator may further include a spring, compliant material, or fluid within the interior space.

Abstract: A system includes a payload ejector configured to contact a payload carried by a flight vehicle and to push the payload away from the flight vehicle. The payload ejector includes a piston configured to extend from the payload ejector and a shock attenuator coupled to the piston, where the shock attenuator is configured to push the payload away from the flight vehicle. The shock attenuator includes a shock attenuator housing and a plunger that is movable within the shock attenuator housing and that extends from the shock attenuator housing. The plunger is configured to be pushed at least partially into the shock attenuator housing in order to damp a shock pulse applied to the payload. The shock attenuator housing may have an interior space, and the shock attenuator may further include a spring, compliant material, or fluid within the interior space.