Abstract: A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. One embodiment provides a method of forming and utilizing a package that exposes regions of an alignment reference plane. The device within the package is mounted on the reference plane such that the exposed regions allow precise alignment with the device in a direction perpendicular to the reference plane. Alignment surfaces formed in a display system or other system contact the reference plane at the exposed regions to position the packaged device relative to other components of the system. One embodiment of the package 400 taught has laminated layers forming the package substrate 402 and providing a precision reference plane 416 relative to the position of the micromirror device 404. The package may be formed by laminating several layers of material in sheets to form several package substrates simultaneously.

Abstract: A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. One embodiment provides a method of forming and utilizing a package that exposes regions of an alignment reference plane. The device within the package is mounted on the reference plane such that the exposed regions allow precise alignment with the device in a direction perpendicular to the reference plane. Alignment surfaces formed in a display system or other system contact the reference plane at the exposed regions to position the packaged device relative to other components of the system. One embodiment of the package 400 taught has laminated layers forming the package substrate 402 and providing a precision reference plane 416 relative to the position of the micromirror device 404. The package may be formed by laminating several layers of material in sheets to form several package substrates simultaneously.

Abstract: A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. One embodiment provides a method of forming and utilizing a package that exposes regions of an alignment reference plane. The device within the package is mounted on the reference plane such that the exposed regions allow precise alignment with the device in a direction perpendicular to the reference plane. Alignment surfaces formed in a display system or other system contact the reference plane at the exposed regions to position the packaged device relative to other components of the system. One embodiment of the package 400 taught has laminated layers forming the package substrate 402 and providing a precision reference plane 416 relative to the position of the micromirror device 404. The package may be formed by laminating several layers of material in sheets to form several package substrates simultaneously.

Abstract: A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. One embodiment provides a method of forming and utilizing a package that exposes regions of an alignment reference plane. The device within the package is mounted on the reference plane such that the exposed regions allow precise alignment with the device in a direction perpendicular to the reference plane. Alignment surfaces formed in a display system or other system contact the reference plane at the exposed regions to position the packaged device relative to other components of the system. One embodiment of the package 400 taught has laminated layers forming the package substrate 402 and providing a precision reference plane 416 relative to the position of the micromirror device 404. The package may be formed by laminating several layers of material in sheets to form several package substrates simultaneously.

Abstract: The disclosed embodiments reveal an analog MEMS device with a pivotal micromirror that is supported by one or more beams that provide non-linear resistance. An electrode can electrostatically attract the micromirror, while the beam(s) provide resistance to deflection. When the forces equalize, the micromirror is held at a target angle. The beam support disclosed in the embodiments is superior to conventional torsion hinge supports, because it provides non-linear support for the micromirror, better matching the non-linear nature of the electrostatic force.

Abstract: A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. One embodiment provides a method of forming and utilizing a package that exposes regions of an alignment reference plane. The device within the package is mounted on the reference plane such that the exposed regions allow precise alignment with the device in a direction perpendicular to the reference plane. Alignment surfaces formed in a display system or other system contact the reference plane at the exposed regions to position the packaged device relative to other components of the system. One embodiment of the package 400 taught has laminated layers forming the package substrate 402 and providing a precision reference plane 416 relative to the position of the micromirror device 404. The package may be formed by laminating several layers of material in sheets to form several package substrates simultaneously.

Abstract: A zeolite and an organic binder are mixed with a solvent to form a paste (302). The paste is then cast or molded (304) into the desired shape. A portion of the solvent is allowed to evaporate from the paste, hardening the getter (306). Getters are often formed in sheets and cut (308) into individual pieces, called dibs, after the sheets have hardened. Even after the getter is hardened, significant amounts of solvent are retained by the getter. The getter is exposed to water vapor which displaces (310) the solvent from the getter. After the solvent is removed, the getter is dried (312) to remove additional water vapor. Because the water vapor does not bind as tightly to the zeolite getter, the water vapor is removed much easier than the solvent. The water may be removed by allowing the getter to dry naturally, or by a vacuum bake process.

Abstract: A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. One embodiment provides a method of forming and utilizing a package that exposes regions of an alignment reference plane. The device within the package is mounted on the reference plane such that the exposed regions allow precise alignment with the device in a direction perpendicular to the reference plane. Alignment surfaces formed in a display system or other system contact the reference plane at the exposed regions to position the packaged device relative to other components of the system. One embodiment of the package 400 taught has laminated layers forming the package substrate 402 and providing a precision reference plane 416 relative to the position of the micromirror device 404. The package may be formed by laminating several layers of material in sheets to form several package substrates simultaneously.

Abstract: The present invention provides methods of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate, where the MEMS device has a sacrificial layer over components formed therein. The method also includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes removing the sacrificial layer through the opening. A MEMS assembly constructed according to a process of the present invention is also disclosed.

Abstract: A zeolite and an organic binder are mixed with a solvent to form a paste (302). The paste is then cast or molded (304) into the desired shape. A portion of the solvent is allowed to evaporate from the paste, hardening the getter (306). Getters are often formed in sheets and cut (308) into individual pieces, called dibs, after the sheets have hardened. Even after the getter is hardened, significant amounts of solvent are retained by the getter. The getter is exposed to water vapor which displaces (310) the solvent from the getter. After the solvent is removed, the getter is dried (312) to remove additional water vapor. Because the water vapor does not bind as tightly to the zeolite getter, the water vapor is removed much easier than the solvent. The water may be removed by allowing the getter to dry naturally, or by a vacuum bake process.

Abstract: A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. One embodiment provides a method of forming and utilizing a package that exposes regions of an alignment reference plane. The device within the package is mounted on the reference plane such that the exposed regions allow precise alignment with the device in a direction perpendicular to the reference plane. Alignment surfaces formed in a display system or other system contact the reference plane at the exposed regions to position the packaged device relative to other components of the system. One embodiment of the package 400 taught has laminated layers forming the package substrate 402 and providing a precision reference plane 416 relative to the position of the micromirror device 404. The package may be formed by laminating several layers of material in sheets to form several package substrates simultaneously.

Abstract: An integrated circuit package and method that provides excellent visibility to the orientation of the package substrate throughout all stages of the device assembly process, and over a wide range of ambient light conditions. The package uses an existing metalization layer to designate a reference corner of the package. A lower portion 102 of the package includes an intermediate metalization layer patterned on the surface of the lower portion. This metalization is used to connect the device 104 being packaged with circuitry outside the package. An upper portion 108 of the package is supported by the lower portion of the package and sandwiches the intermediate layer. At least one corner of the upper layer 108 exposes a region 110 of the intermediate metalization layer. This region is highly visible since it is reflective and located outside of the package cavity. The metalization region 110 may also be plated or tinned to increase its visibility.