Abstract: This disclosure relates to a dual-purpose grab handle and tie-down bracket for a motor vehicle. An example vehicle includes a body panel defining at least a portion of a recess, and a component mounted at least partially in the recess. Further, the component provides a tie-down bracket configured to attach to a tie-down and a grab handle configured to be grasped by a hand of a user.

Abstract: An optical electronics device includes first, second and third wafers. The first wafer has a semiconductor substrate with a dielectric layer on a side of the semiconductor substrate. The second wafer has a transparent substrate with an anti-reflective coating on a side of the transparent substrate. The first wafer is bonded to the second wafer at a silicon dioxide layer between the semiconductor substrate and the anti-reflective coating. The first and second wafers include a cavity extending from the dielectric layer through the semiconductor substrate and through the silicon dioxide layer to the anti-reflective coating. The third wafer includes micromechanical elements. The third wafer is bonded to the dielectric layer, and the micromechanical elements are contained within the cavity.

Abstract: In described examples, a transient liquid phase (TLP) metal bonding material includes a first substrate and a base metal layer. The base metal layer is disposed over at least a portion of the first substrate. The base metal has a surface roughness (Ra) of between about 0.001 to 500 nm. Also, the TLP metal bonding material includes a first terminal metal layer that forms an external surface of the TLP metal bonding material. A metal fuse layer is positioned between the base metal layer and the first terminal metal layer. The TLP metal bonding material is stable at room temperature for at least a predetermined period of time.

Abstract: Windowed wafer assemblies having interposers are described. A described example integrated circuit (IC) package includes first and second dies, where at least one of the first or second dies includes an optical window with a light transmittance wavelength range between 0.1 micrometers and 1.0 millimeter, and an interposer die between the first and second dies, where the interposer die is coupled to the first die at a first surface of the interposer to form a first bonded interface, where the interposer is coupled to the second die at a second surface of the interposer die to form a second bonded interface, where the second surface is opposite the first surface, where the first and second bonded interfaces form a sealed cavity of the IC package that is at least partially formed by the optical window, and where the interposer die includes electrical routing.

Abstract: An integrated filter optical package including an ambient light sensor that incorporates an infrared (IR) filter in an integrated circuit (IC) stacked-die configuration is provided. The integrated filter optical package incorporates an infrared (IR) coated glass layer to filter out or block IR light while allowing visible (ambient) light to pass through to a light sensitive die having a light sensor. The ambient light sensor detects an amount of visible light that passes through the IR coated glass layer and adjusts a brightness or intensity of a display screen on an electronic device accordingly so that the display screen is readable.

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

Abstract: An optical electronics device includes first, second and third wafers. The first wafer has a semiconductor substrate with a dielectric layer on a side of the semiconductor substrate. The second wafer has a transparent substrate with an anti-reflective coating on a side of the transparent substrate. The first wafer is bonded to the second wafer at a silicon dioxide layer between the semiconductor substrate and the anti-reflective coating. The first and second wafers include a cavity extending from the dielectric layer through the semiconductor substrate and through the silicon dioxide layer to the anti-reflective coating. The third wafer includes micromechanical elements. The third wafer is bonded to the dielectric layer, and the micromechanical elements are contained within the cavity.

Abstract: A microelectronic device package includes a host material and a gettering material. The microelectronic device package also includes a polymeric component between the host material and the gettering material. The polymeric component substantially encapsulates the gettering material. The microelectronic device package further includes a fluorochemical lubricant. The polymeric component serves to prevent a reaction between the fluorochemical lubricant and the gettering material. Alternatively, the fluorochemical lubricant may be encapsulated by a polymeric component and may be released upon an increase in temperature during or after a packaging step.

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

Abstract: A semiconductor device includes a solder supporting material above a substrate. The semiconductor device also includes a solder on the solder supporting material. The semiconductor device further includes selective laser annealed or laser ablated portions of the solder and underlying solder supporting material to form a semiconductor device having 3D features.

Abstract: Millimeter wave energy is provided to a spectroscopy cavity of a spectroscopy device that contains interrogation molecules. The microwave energy is received after it traverses the spectroscopy cavity. The amount of interrogation molecules in the spectroscopy cavity is adjusted by activating a precursor material in one or more sub-cavities coupled to the spectroscopy cavity by a diffusion path to increase the amount of interrogation molecules or by activating the getter material in one or more sub-cavities coupled to the spectroscopy cavity by a diffusion path to decrease the amount of interrogation molecules.

Abstract: Described are techniques for providing an interactive user interface configured to receive at least two types of user input, such as a tap gesture and a swipe gesture provided to a control region of the user interface. Responsive to the first type of user input, a first process may be performed, such as adding an indication of an item to an electronic list for a future purchase. Responsive to the second type of user input, a second process may be performed, such as the immediate purchase of an item based on stored shipping and payment data. In some cases, data associated with a process may be accessed responsive to the initiation of user input, but the process may not be initiated until the user input has been completed. Modifications to characteristics of the process may be changed responsive to additional user input provided to the control region.

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

Abstract: An illustrate method (and device) includes etching a cavity in a first substrate (e.g., a semiconductor wafer), forming a first metal layer on a first surface of the first substrate and in the cavity, and forming a second metal layer on a non-conductive structure (e.g., glass). The method also may include removing a portion of the second metal layer to form an iris to expose a portion of the non-conductive structure, forming a bond between the first metal layer and the second metal layer to thereby attach the non-conductive structure to the first substrate, sealing an interface between the non-conductive structure and the first substrate, and patterning an antenna on a surface of the non-conductive structure.

Abstract: Methods for depositing a measured amount of a species in a sealed cavity. In one example, a method for depositing molecules in a sealed cavity includes depositing a selected number of microcapsules in a cavity. Each of the microcapsules contains a predetermined amount of a first fluid. The cavity is sealed after the microcapsules are deposited. After the cavity is sealed the microcapsules are ruptured to release molecules of the first fluid into the cavity.

Abstract: A method includes forming a plurality of layers of an oxide and a metal on a substrate. For example, the layers may include a metal layer sandwiched between silicon oxide layers. A non-conductive structure such as glass is then bonded to one of the oxide layers. An antenna can then be patterned on the non-conductive structure, and a cavity can be created in the substrate. Another metal layer is deposited on the surface of the cavity, and an iris is patterned in the metal layer to expose the one of the oxide layers. Another metal layer is formed on a second substrate and the two substrates are bonded together to thereby seal the cavity.

Abstract: A method for forming a sealed cavity includes bonding a non-conductive structure to a first substrate to form a non-conductive aperture into the first substrate. On a surface of the non-conductive structure opposite the first substrate, the method includes depositing a first metal layer. The method further includes patterning a first iris in the first metal layer, depositing a first dielectric layer on a surface of the first metal layer opposite the non-conductive structure, and patterning an antenna on a surface of the first dielectric layer opposite the first metal layer. The method also includes creating a cavity in the first substrate, depositing a second metal layer on a surface of the cavity, patterning a second iris in the second metal layer, and bonding a second substrate to a surface of the first substrate opposite the non-conductive structure to thereby seal the cavity.

Abstract: Described examples include a method of fabricating a gas cell, including forming a cavity in a first substrate, providing a nonvolatile precursor material in the cavity of the first substrate, bonding a second substrate to the first substrate to form a sealed cavity including the nonvolatile precursor material in the cavity, and activating the precursor material after or during forming the sealed cavity to release a target gas inside the sealed cavity.

Abstract: Disclosed examples provide gas cells and a method of fabricating a gas cell, including forming a cavity in a first substrate, forming a first conductive material on a sidewall of the cavity, forming a glass layer on the first conductive material, forming a second conductive material on a bottom side of a second substrate, etching the second conductive material to form apertures through the second conductive material, forming conductive coupling structures on a top side of the second substrate, and bonding a portion of the bottom side of the second substrate to a portion of the first side of the first substrate to seal the cavity.

Abstract: Described examples include a method of fabricating a gas cell, including forming a cavity in a first substrate, providing a nonvolatile precursor material in the cavity of the first substrate, bonding a second substrate to the first substrate to form a sealed cavity including the nonvolatile precursor material in the cavity, and activating the precursor material after or during forming the sealed cavity to release a target gas inside the sealed cavity.