Patents by Inventor Joshua Keener

Joshua Keener has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220413213
    Abstract: Silicon photonic integrated circuit (PIC) on a multi-zone semiconductor on insulator (SOI) substrate having at least a first zone and a second zone. Various optical devices of the PIC may be located above certain substrate zones that are most suitable. A first length of a photonic waveguide structure comprises the crystalline silicon and is within the first zone, while a second length of the waveguide structure is within the second zone. Within a first zone, the crystalline silicon layer is spaced apart from an underlying substrate material by a first thickness of dielectric material. Within the second zone, the crystalline silicon layer is spaced apart from the underlying substrate material by a second thickness of the dielectric material.
    Type: Application
    Filed: June 25, 2021
    Publication date: December 29, 2022
    Applicant: Intel Corporation
    Inventors: Harel Frish, John Heck, Randal Appleton, Stefan Meister, Haisheng Rong, Joshua Keener, Michael Favaro, Wesley Harrison, Hari Mahalingam, Sergei Sochava
  • Publication number: 20200393619
    Abstract: Embodiments of the present disclosure are directed to low numerical aperture (NA) optical couplers, or spot size converters, that include a lateral taper section and/or a vertical adiabatic taper section. In embodiments, the optical couplers may be positioned on a silicon substrate proximate to V-grooves within the substrate to contain optical fibers to self-align and to couple with the optical couplers. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: August 27, 2020
    Publication date: December 17, 2020
    Inventors: Hari Mahalingam, Harel Frish, Sean McCargar, Joshua Keener, Shane Yerkes, John Heck, Ling Liao