Abstract: An apparatus and method of blind detection of binauralized audio. If the input content is detected as binaural, a second binauralization may be avoided. In this manner, the user experience avoids audio artifacts introduced by multiple binauralizations.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method is provided for fabricating micro-electromechanical devices. Generally, the method includes: (i) forming a device layer over a sacrificial layer on a surface of a substrate; (ii) patterning the device layer to form a number of ribbons each including a long axis parallel to the surface of the substrate and a middle section between support structures at both ends of the ribbon; (iii) partially removing the sacrificial layer to undercut the number of ribbons; (iv) forming a reflective coating of a reflective material on the number of ribbons; and (v) releasing the middle section of at least one of the number of ribbons by removing the sacrificial layer. Undercutting the ribbons prior to forming the reflective coating reduces build-up of material on sidewalls of the sacrificial layer facilitating release of the ribbons. Other embodiments are also disclosed.