Patents by Inventor Joshua MICHALAK

Joshua MICHALAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COPPER INTERFACE FEATURES FOR HIGH SPEED INTERCONNECT APPLICATIONS
    Publication number: 20200315023
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a first layer of a package substrate and a conductive trace over the first layer of the package substrate. In an embodiment, the conductive trace comprises a conductive body with a first surface over the first layer of the package substrate, a second surface opposite the first surface, and sidewall surfaces coupling the first surface to the second surface. In an embodiment, the second surface has a first roughness and the sidewall surfaces have a second roughness that is less than the first roughness.
    Type: Application
    Filed: March 25, 2019
    Publication date: October 1, 2020
    Inventors: Suddhasattwa NAD, Kassandra NIKKHAH, Joshua MICHALAK, Marcel WALL, Rahul MANEPALLI, Cemil GEYIK, Benjamin DUONG, Darko GRUJICIC