Patents by Inventor Joshua Nickel

Joshua Nickel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular semiconductor die package and method of manufacturing thereof
    Patent number: 6700138
    Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: March 2, 2004
    Assignee: Silicon Bandwidth, Inc.
    Inventors: Stanford W. Crane, Jr., Jennifer Colegrove, Zsolt Horvath, Myoung-soo Jeon, Joshua Nickel, Lei-Ming Yang
  • Modular semiconductor die package and method of manufacturing thereof
    Publication number: 20040026757
    Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.
    Type: Application
    Filed: August 8, 2003
    Publication date: February 12, 2004
    Applicant: Silicon Bandwidth, Inc.
    Inventors: Stanford W. Crane, Jennifer Colegrove, Zsolt Horvath, Myoung-Soo Jeon, Joshua Nickel, Lei-Ming Yang
  • Modular semiconductor die package and method of manufacturing thereof
    Publication number: 20030160314
    Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.
    Type: Application
    Filed: February 25, 2002
    Publication date: August 28, 2003
    Inventors: Stanford W. Crane, Jennifer Colegrove, Zsolt Horvath, Myoung-soo Jeon, Joshua Nickel, Lei-Ming Yang