Patents by Inventor JOSHUA P. OSBORNE

JOSHUA P. OSBORNE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cryogenic wafer test system
    Patent number: 11693047
    Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: July 4, 2023
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Tessandra Anne Sage, Stanley Katsuyoshi Wakamiya, Jonathan Francis Van Dyke, Kevin Collao, Joshua P. Osborne
  • CRYOGENIC WAFER TEST SYSTEM
    Publication number: 20230003788
    Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 5, 2023
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: TESSANDRA ANNE SAGE, STANLEY KATSUYOSHI WAKAMIYA, JONATHAN FRANCIS VAN DYKE, KEVIN COLLAO, JOSHUA P. OSBORNE