Abstract: Devices, systems, and methods for cooling electronic component heat spreaders, for example, a heat spreader mounted over a CPU of personal computer, are disclosed. The devices, systems, and methods employ a housing having an internal cavity with an open bottom; a gasket positioned between the open bottom and the heat spreader; a cooling fluid inlet to the housing adapted to direct a cooling fluid upon the heat spreader in a direction substantially normal to heat spreader; and a cooling fluid outlet positioned to remove the cooling fluid from the housing. Though aspects of the invention can be applied to any electronic component that can benefit from enhanced heat dissipation, users of high-performance computer equipment, such as, gamers, scientific and mathematical modelers, and engineers may find aspects of the invention particularity advantageous.