Patents by Inventor Joshua PINNOLIS

Joshua PINNOLIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10937757
    Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: March 2, 2021
    Assignee: SEMIgear, Inc.
    Inventors: Jian Zhang, Joshua Pinnolis, Shijian Luo
  • Publication number: 20190229086
    Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Application
    Filed: April 2, 2019
    Publication date: July 25, 2019
    Applicant: SEMIgear, Inc.
    Inventors: Jian ZHANG, Joshua PINNOLIS, Shijian LUO
  • Patent number: 10283481
    Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: May 7, 2019
    Assignee: Semigear, Inc.
    Inventors: Jian Zhang, Joshua Pinnolis, Shijian Luo
  • Publication number: 20180033766
    Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Application
    Filed: June 21, 2017
    Publication date: February 1, 2018
    Applicant: SEMlgear, Inc.
    Inventors: Jian ZHANG, Joshua PINNOLIS, Shijian LUO
  • Patent number: 9824998
    Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: November 21, 2017
    Assignee: Semigear, Inc.
    Inventors: Jian Zhang, Joshua Pinnolis, Shijian Luo
  • Patent number: 9741683
    Abstract: Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: August 22, 2017
    Assignee: Semigear, Inc.
    Inventors: Jian Zhang, Joshua Pinnolis, Shijian Luo
  • Publication number: 20160336294
    Abstract: Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Application
    Filed: July 28, 2016
    Publication date: November 17, 2016
    Applicant: SEMlgear, Inc.
    Inventors: Jian ZHANG, Joshua PINNOLIS, Shijian LUO
  • Publication number: 20160336293
    Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Application
    Filed: July 27, 2016
    Publication date: November 17, 2016
    Applicant: SEMIgear, Inc.
    Inventors: Jian ZHANG, Joshua Pinnolis, Shijian Luo
  • Patent number: 9472531
    Abstract: Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: October 18, 2016
    Assignee: Semigear, Inc.
    Inventors: Jian Zhang, Joshua Pinnolis, Shijian Luo
  • Publication number: 20160233191
    Abstract: Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.
    Type: Application
    Filed: February 6, 2015
    Publication date: August 11, 2016
    Inventors: Jian ZHANG, Joshua PINNOLIS, Shijian LUO