Abstract: A semiconductor module has a conductive heat sink base which receives a power semiconductor and a printed circuit board mounted above the heat sink and carrying control circuits for the power semiconductor. A rigid L-shaped terminal connected to one electrode of the power semiconductor is mounted on the base and extends upward and adjacent an edge of the printed circuit board. A Hall sensor is mounted on the printed circuit board and is disposed in and intercepts the magnetic field produced by current in the terminal. Magnetic bodies are mounted on opposite sides of the Hall element to concentrate the magnetic field through the Hall sensor.

Abstract: An electronic module is provided using one or more field effect transistors (FETs) arranged on a conductive plate such that the module is capable of switching very high currents while remaining compact and still providing excellent thermal management properties. A plurality of conductive plates are bonded with an insulating material, the insulating material also forms a housing. One or more FETs are arranged inside the housing on one of the plates such that an electrical connection is made between a first region of the FET and the plate. A second FET region is electrically connected to another conductive plate. A circuit board is contained within the housing in which an electrical connection is made between the second region and the circuit board, and between a third FET region and the circuit board.

Abstract: A metal oxide semiconductor (MOSFET) half bridge module for use in a 42 volt internal combustion engine starter/alternator circuit. The module is a compact, high power handling device which has an extremely low inductance. This low inductance module supports the current and current slew rates necessary to properly operate in an internal combustion engine starter/alternator circuit across a wide temperature range. The module has a thermally conductive base. A plurality of lower circuit boards are adjacently positioned within the base along the same plane. At least one semiconductor device has a first surface, the first surface of the semiconductor device is mounted to one of the plurality of circuit boards. A common terminal has planar portion which is coupled to each of the plurality of lower circuit boards. An upper circuit board is in electrical contact with the plurality of lower circuit boards and includes a connector providing external access for drive signals for the semiconductor device.