Abstract: According to some embodiments, indicator circuitry is integrated into a coaxial antenna cable of a radio frequency identification (RFID) reader. The indicator circuitry includes an injected DC offset to power one or more visual or audio indicators without interfering with a radio frequency (RF) signal received or transmitted on the antenna.

Abstract: According to some embodiments, read range control update information is received in a radio frequency (RF) signal. The information is used to control a read range of an antenna. The read range of the antenna can be increased or deceased, for example, by changing an impedance of the antenna.

Abstract: A digital storage medium (e.g., a CDROM, a DVD, a tape, etc.) has an integrated RFID tag to store information for use in controlling access to the data stored on the digital storage medium.

Abstract: A single antenna may be powered to illuminate or transmit to a receiver such as an RFID tag. That tag may then provide a responsive signal to a plurality of antennas, each of which are active. The signals from those antennas may be analyzed to determine which signal has the highest quality. This may be used to select a particular signal for future analysis or to select a particular antenna for use as both a transmission and reception antenna for future operations. For example, the antenna which provides the strongest signal may be utilized to further illuminate a given RFID tag.

Abstract: Apparatus, system, and method for wireless module enabled component carrier for parts inventory and tracking are described.

Abstract: Embodiments of the present invention utilize two photodiodes on the same substrate, one illuminated monitor photodiode to monitor an optical beam out of a back facet (or back scattered) of a laser, and one non-illuminated reference photodiode to characterize in real time radio frequency (RF) parameters/performance to control extinction ratio and optical modulation amplitude of the laser beam.

Abstract: A radio frequency identification (RFID) antenna and/or RFID tag circuit may be fabricated on a substrate. The substrate may be a wafer, a die created from a wafer, or an integrated circuit package substrate. The RFID tag may also be distributed between the die and the package substrate in an integrated circuit package. In some embodiments the RFID tag may be fabricated in the lower layers of the substrate and become operational before the rest of the circuitry on the substrate has been fabricated.

Abstract: An optical device, such as a vertical cavity surface emitting laser (VCSEL) may be housed in a hermetic enclosure such as a transistor-outline (TO) can and form part of a transmitter optical subassembly (TOSA). The TOSA may be connected to a printed circuit board (PCB) with a flexible circuit. A heating element provided on the flexible circuit heats the hermetic enclosure to improve radio frequency (RF) performance of the optical device in cold ambient conditions.

Abstract: An optical-electronic interface may include a circuit substrate, an electrical component mounted on the substrate, an optical component mounted off the substrate, and a flexible interconnect having a first end electrically connected to the optical component and second end electrically connected proximate to the optical component. The electrical component may include electrical leads and the circuit substrate may include electrically conductive traces connected to the electrical leads. The second end of the flexible interconnect may be electrically connected directly to the electrical leads of the electrical component or directly to the electrically conductive traces at a position located proximate to the electrical component.