Patents by Inventor Joshua S. Hess

Joshua S. Hess has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11944822
    Abstract: A space-saving configuration for electronics is disclosed in which at least four circuit boards are arranged to form sides of a five-or-greater sided geometric prism that are perpendicular to a common plane. That is, they are stood up on their sides and connected with flex cable to approximate a cylinder. Each circuit board can include one or more sides with electrical components. The circuit boards make up at least half of the five-or-greater sided geometric prism such that the circuit boards wrap at least halfway around. A common connector on one of the circuit boards can be configured to receive power from an underlying motherboard, and flex cables connecting adjacent circuit boards in series distribute power received from the connector to each of the circuit boards in series.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: April 2, 2024
    Assignee: NEURALINK CORP.
    Inventors: Joshua S. Hess, Mark J. Smith
  • Publication number: 20230168317
    Abstract: The disclosure provides a soak tester apparatus for testing an implantable enclosure having an impedance engine, a multiplexer and a removably attached cartridge, which cartridge has a plurality of threads, comprising a Faraday cage housing; a receptacle disposed within the Faraday cage housing, wherein the receptacle is configured to host an implantable enclosure having an impedance engine, a multiplexer and a removably attached cartridge, which cartridge has a plurality of threads; and a pigtail disposed within the Faraday cage housing having a charging coil configured to power the implantable enclosure.
    Type: Application
    Filed: November 29, 2021
    Publication date: June 1, 2023
    Applicant: Neuralink Corp.
    Inventors: John W.F. To, Srinivasan Ramakrishnan, Julian Borrey, Russell Ohnemus, Joshua S. Hess, Robin E. Young, Sonal Pinto
  • Patent number: 11662395
    Abstract: The disclosure provides a soak tester apparatus for testing an implantable enclosure having an impedance engine, a multiplexer and a removably attached cartridge, which cartridge has a plurality of threads, comprising a Faraday cage housing; a receptacle disposed within the Faraday cage housing, wherein the receptacle is configured to host an implantable enclosure having an impedance engine, a multiplexer and a removably attached cartridge, which cartridge has a plurality of threads; and a pigtail disposed within the Faraday cage housing having a charging coil configured to power the implantable enclosure.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: May 30, 2023
    Assignee: NEURALINK CORP.
    Inventors: John W. F. To, Srinivasan Ramakrishnan, Julian Borrey, Russell Ohnemus, Joshua S. Hess, Robin E. Young, Sonal Pinto
  • Publication number: 20230147266
    Abstract: Accelerated testing apparatuses for implants are described, as well as methods for accelerated testing implants. The accelerated testing apparatus includes a cabinet having multiple bays and a vessel insertable and removable from any of the multiple bays. The vessel includes a watertight basin, a radio-frequency (RF) transparent lid configured to mate with the basin, and a plurality of fixtures within the vessel. Each fixture is adapted to anchor a device-under-test while submersed within the vessel. The accelerated testing apparatus also includes a reservoir disposed within the cabinet, a heater connected with the reservoir, a pump configured to circulate liquid between the reservoir and the vessel, an antenna within the cabinet for communication with the device-under-test, and at least one computer server operatively connected with the antenna.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 11, 2023
    Applicant: Neuralink Corp.
    Inventors: Amir Mazaheripour, Joshua S. Hess, Andrew D. Wong, Amir M. Foudeh, Ava S.K. Greenwood, Alan R. Mardinly, Alejandro J. Tenorio, Ian C.C. Switzer
  • Publication number: 20230137530
    Abstract: A coil formed from a flexible polymer substrate that is printed with metal traces is disclosed in which the flexible substrate has notches that align each loop as the substrate is wound into a ring. The notches are precisely spaced so that the diameter of each loop is well controlled. As the substrate is wound, adhesive is applied along its length to fill gaps between each loop's layer. Ideally, the adhesive has a similar dielectric constant as the polymer substrate. The resulting coil has loops of metal traces separated by precise a thickness of dielectric. The precision in spacing between metal layers and dielectric allows the coil to be designed for self-resonance.
    Type: Application
    Filed: October 28, 2021
    Publication date: May 4, 2023
    Applicant: Neuralink Corp.
    Inventors: Lucia Fauth, Joshua S. Hess
  • Publication number: 20230069855
    Abstract: Methods and systems of using a laser beam to weld an object with a non-flat surface, including curved surfaces, are described, where at least one piece of the object is transparent. An optical guide with a flat surface and an interface surface is placed on a piece of an object to welded. The interface surface is fabricated to form-fit the non-flat surface of the object to be welded, and is opposite the flat surface. A liquid optical medium is applied between the non-flat surface and the interface surface, filling any gaps or surface defects. The laser beam is then transmitted through the optical guide, liquid optical medium, and into the object to be welded, to a location to be welded. The laser beam then welds the object to be welded at pre-determined points.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Neuralink Corp
    Inventors: Joshua S. Hess, Emilienne M. Repak
  • Publication number: 20230063165
    Abstract: A space-saving configuration for electronics is disclosed in which at least four circuit boards are arranged to form sides of a five-or-greater sided geometric prism that are perpendicular to a common plane. That is, they are stood up on their sides and connected with flex cable to approximate a cylinder. Each circuit board can include one or more sides with electrical components. The circuit boards make up at least half of the five-or-greater sided geometric prism such that the circuit boards wrap at least halfway around. A common connector on one of the circuit boards can be configured to receive power from an underlying motherboard, and flex cables connecting adjacent circuit boards in series distribute power received from the connector to each of the circuit boards in series.
    Type: Application
    Filed: September 1, 2021
    Publication date: March 2, 2023
    Applicant: Neuralink Corp.
    Inventors: Joshua S. Hess, Mark J. Smith