Patents by Inventor Joshua Schoenly
Joshua Schoenly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230405713Abstract: A surface treating method and apparatus include operating a quasi-continuous wave fiber laser and pre-scan shaping the laser beam such that an instantaneous spot beam has predetermined geometrical dimensions, intensity profile, and power; operating a scanner at an optimal angular velocity and angular range to divide the pre-scan beam into at least one sub-beam deflected toward the surface being processed; guiding the sub-beam through a post-scan optical assembly to provide the spot beam with predetermined geometrical dimensions, power, and angular velocity and range, which are selected such that the instantaneous spot beam is dragged in a scan direction over a desired length at a desired scan velocity, which allow the treated surface to be exposed for a predetermined exposure duration and have a predetermined fluence distribution providing the treated surface with a quality comparable to that of the surface processed by an excimer laser or a burst-mode fiber laser.Type: ApplicationFiled: May 24, 2023Publication date: December 21, 2023Applicant: IPG PHOTONICS CORPORATIONInventors: Alexander LIMANOV, Michael VON DADELSZEN, Joshua SCHOENLY, James CORDINGLEY, Manuel LEONARDO
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Patent number: 11819949Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: October 19, 2020Date of Patent: November 21, 2023Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Patent number: 11673208Abstract: A surface treating method and apparatus include operating a quasi-continuous wave fiber laser and pre-scan shaping the laser beam such that an instantaneous spot beam has predetermined geometrical dimensions, intensity profile, and power; operating a scanner at an optimal angular velocity and angular range to divide the pre-scan beam into a plurality of sub-beams deflected towards the surface being processed; guiding the sub-beams through a post-scan optical assembly to provide the spot beam with predetermined geometrical dimensions, power, and angular velocity and range, which are selected such that the instantaneous spot beam is dragged in a scan direction over a desired length at a desired scan velocity, which allow the treated surface to be exposed for a predetermined exposure duration and have a predetermined fluence distribution providing the treated surface with a quality comparable to that of the surface processed by an excimer laser or a burst-mode fiber laser.Type: GrantFiled: July 31, 2018Date of Patent: June 13, 2023Assignee: IPG PHOTONICS CORPORATIONInventors: Alexander Limanov, Michael Von Dadelszen, Joshua Schoenly, James Cordingley, Manuel Leonardo
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Patent number: 11600491Abstract: A method of fiber laser processing of thin film deposited on a substrate includes providing a laser beam from at least one fiber laser which is guided through a beam-shaping unit onto the thin film. The beam-shaping optics is configured to shape the laser beam into a line beam which irradiates a first irradiated thin film area Ab on a surface of the thin film, with the irradiated thin film area Ab being a fraction of the thin film area Af. By continuously displacing the beam shaping optics and the film relative to one another in a first direction at a distance dy between sequential irradiations, a sequence of uniform irradiated thin film areas Ab are formed on the film surface defining thus a first elongated column. Thereafter the beam shaped optics and film are displaced relative to one another at a distance dx in a second direction transverse to the first direction with the distance dx being smaller than a length of the irradiated film area Ab.Type: GrantFiled: July 31, 2018Date of Patent: March 7, 2023Assignee: IPG PHOTONICS CORPORATIONInventors: Limanov Alexander, Michael Von Dadelszen, Joshua Schoenly, Manuel Leonardo
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Patent number: 11565350Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: May 24, 2019Date of Patent: January 31, 2023Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Publication number: 20210098255Abstract: A method of fiber laser processing of thin film deposited on a substrate includes providing a laser beam from at least one fiber laser which is guided through a beam-shaping unit onto the thin film. The beam-shaping optics is configured to shape the laser beam into a line beam which irradiates a first irradiated thin film area Ab on a surface of the thin film, with the irradiated thin film area Ab being a fraction of the thin film area Af. By continuously displacing the beam shaping optics and the film relative to one another in a first direction at a distance dy between sequential irradiations, a sequence of uniform irradiated thin film areas Ab are formed on the film surface defining thus a first elongated column. Thereafter the beam shaped optics and film are displaced relative to one another at a distance dx in a second direction transverse to the first direction with the distance dx being smaller than a length of the irradiated film area Ab.Type: ApplicationFiled: July 31, 2018Publication date: April 1, 2021Inventors: LIMANOV Alexander, Michael VON DADELSZEN, Joshua SCHOENLY, Manuel LEONARDO
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Publication number: 20210094127Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: ApplicationFiled: October 19, 2020Publication date: April 1, 2021Inventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Publication number: 20210008660Abstract: A surface treating method and apparatus include operating a quasi-continuous wave fiber laser and pre-scan shaping the laser beam such that an instantaneous spot beam has predetermined geometrical dimensions, intensity profile, and power; operating a scanner at an optimal angular velocity and angular range to divide the pre-scan beam into a plurality of sub-beams deflected towards the surface being processed; guiding the sub-beams through a post-scan optical assembly to provide the spot beam with predetermined geometrical dimensions, power, and angular velocity and range, which are selected such that the instantaneous spot beam is dragged in a scan direction over a desired length at a desired scan velocity, which allow the treated surface to be exposed for a predetermined exposure duration and have a predetermined fluence distribution providing the treated surface with a quality comparable to that of the surface processed by an excimer laser or a burst-mode fiber laser.Type: ApplicationFiled: July 31, 2018Publication date: January 14, 2021Inventors: Alexander LIMANOV, Michael VON DADELSZEN, Joshua SCHOENLY, James CORDINGLEY, Manuel LEONARDO
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Patent number: 10807199Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: September 19, 2017Date of Patent: October 20, 2020Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Publication number: 20190314934Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: ApplicationFiled: May 24, 2019Publication date: October 17, 2019Inventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Patent number: 10343237Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: August 28, 2015Date of Patent: July 9, 2019Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Patent number: 9956646Abstract: Multiple-beam laser processing may be performed on a workpiece using at least first and second laser beams with different characteristics (e.g., wavelengths and/or pulse durations). In some applications, an assist laser beam is directed at a target location on or within the workpiece to modify a property of the non-absorptive material. A process laser beam is directed at the target location and is coupled into absorption centers formed in the non-absorptive material to complete processing of the non-absorptive material. Multiple-beam laser processing may be used, for example, to drill holes in a substrate made of alumina or other transparent ceramics. In other applications, multiple-beam laser processing may be used in melting applications such as micro-welding, soldering, and forming laser fired contacts. In these applications, the assist laser beam may be used to modify a property of the material or to change the geometry of the parts.Type: GrantFiled: February 27, 2015Date of Patent: May 1, 2018Assignee: IPG Photonics CorporationInventors: Marco Mendes, Jeffrey P. Sercel, Rouzbeh Sarrafi, Xiangyang Song, Joshua Schoenly, Roy Van Gemert, Cristian Porneala
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Publication number: 20180001425Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: ApplicationFiled: September 19, 2017Publication date: January 4, 2018Inventors: Jeffrey P. SERCEL, Marco MENDES, Rouzbeh SARRAFI, Joshua SCHOENLY, Xiangyang SONG, Mathew HANNON, Miroslaw SOKOL
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Patent number: 9764427Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: August 28, 2015Date of Patent: September 19, 2017Assignee: IPG Photonics CorporationInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Publication number: 20160059354Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: ApplicationFiled: August 28, 2015Publication date: March 3, 2016Inventors: Jeffrey P. SERCEL, Marco MENDES, Rouzbeh SARRAFI, Joshua SCHOENLY, Xiangyang SONG, Mathew HANNON, Miroslaw SOKOL
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Publication number: 20160059349Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: ApplicationFiled: August 28, 2015Publication date: March 3, 2016Inventors: Jeffrey P. SERCEL, Marco MENDES, Rouzbeh SARRAFI, Joshua SCHOENLY, Xiangyang SONG, Mathew HANNON, Miroslaw SOKOL
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Publication number: 20150246412Abstract: Multiple-beam laser processing may be performed on a workpiece using at least first and second laser beams with different characteristics (e.g., wavelengths and/or pulse durations). In some applications, an assist laser beam is directed at a target location on or within the workpiece to modify a property of the non-absorptive material. A process laser beam is directed at the target location and is coupled into absorption centers formed in the non-absorptive material to complete processing of the non-absorptive material. Multiple-beam laser processing may be used, for example, to drill holes in a substrate made of alumina or other transparent ceramics. In other applications, multiple-beam laser processing may be used in melting applications such as micro-welding, soldering, and forming laser fired contacts. In these applications, the assist laser beam may be used to modify a property of the material or to change the geometry of the parts.Type: ApplicationFiled: February 27, 2015Publication date: September 3, 2015Inventors: Marco Mendes, Jeffrey P. Sercel, Rouzbeh Sarrafi, Xiangyang Song, Joshua Schoenly, Roy Van Gemert, Cristian Porneala