Abstract: A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.

Abstract: A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.

Abstract: A monolithic oscillating heat pipe (OHP) device comprising a monolithic body and an oscillating heat pipe (OHP) circuit integrally formed within the body. The OHP circuit is structured and operable to isothermally spread throughout the body heat from a heat source disposed on a heat source portion of the body and in thermally conductive contact with a portion of the OHP circuit. The monolithic OHP device further comprising a pumped fluid (PF) circuit integrally formed within the body and in thermally conductive contact with at least portion of the OHP circuit internally within the body. The PF circuit is structured and operable to remove heat from the portion of the OHP circuit in which the PF circuit is in thermally conductive contact with.