Abstract: A die carrier assembly configured for use in a crimping machine. The assembly includes die carriers disposed in a circumferential arrangement and adapted for radially inward and outward travel. Each die carrier has oppositely-disposed circumferential extents that define circumferential gaps between adjacent pairs of the die carriers. Shoes are disposed radially inward from the die carriers and are adapted for radially inward and outward travel with the die carriers. The shoes travel radially inward and outward with the die carriers between positions in which the shoes define minimum and maximum openings, respectively, of the die carrier assembly. At least one of the shoes is disposed radially inward from one of the circumferential gaps between at least one adjacent pair of the die carriers. The circumferential extents of the adjacent pair of die carriers define interdigitated fingers that support the shoe when the die carrier assembly is at its maximum opening position.

Abstract: A die carrier assembly configured for use in a crimping machine. The assembly includes die carriers disposed in a circumferential arrangement and adapted for radially inward and outward travel. Each die carrier has oppositely-disposed circumferential extents that define circumferential gaps between adjacent pairs of the die carriers. Shoes are disposed radially inward from the die carriers and are adapted for radially inward and outward travel with the die carriers. The shoes travel radially inward and outward with the die carriers between positions in which the shoes define minimum and maximum openings, respectively, of the die carrier assembly. At least one of the shoes is disposed radially inward from one of the circumferential gaps between at least one adjacent pair of the die carriers. The circumferential extents of the adjacent pair of die carriers define interdigitated fingers that support the shoe when the die carrier assembly is at its maximum opening position.