Patents by Inventor Joshua Underdown

Joshua Underdown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-complexity coverage-based compression
    Patent number: 12093573
    Abstract: An embodiment of an electronic apparatus may include a substrate, and logic coupled to the substrate, the logic to determine a base value to compress a block of data, wherein the block of data consists of a first number of data words, replace original values from a second number of data words from the block of data with respective delta values from the base value to provide compressed data, wherein the second number of data words is at least two less than the first number of data words, and store metadata associated with the block of data together with the compressed data in the block of data. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: September 17, 2024
    Assignee: Intel Corporation
    Inventors: Alaa Alameldeen, Amir Ali Radjai, Jason Van Dyken, Aditya Nagaraja, Joshua Underdown, James Greensky, Wei Wu
  • LOW-COMPLEXITY COVERAGE-BASED COMPRESSION
    Publication number: 20210255808
    Abstract: An embodiment of an electronic apparatus may include a substrate, and logic coupled to the substrate, the logic to determine a base value to compress a block of data, wherein the block of data consists of a first number of data words, replace original values from a second number of data words from the block of data with respective delta values from the base value to provide compressed data, wherein the second number of data words is at least two less than the first number of data words, and store metadata associated with the block of data together with the compressed data in the block of data. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: January 29, 2021
    Publication date: August 19, 2021
    Applicant: Intel Corporation
    Inventors: Alaa Alameldeen, Amir Ali Radjai, Jason Van Dyken, Aditya Nagaraja, Joshua Underdown, James Greensky, Wei Wu