Patents by Inventor Joshua W. Smith

Joshua W. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8262204
    Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: September 11, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David M. Braun, Siddhartha Bhowmik, Swaroop K. Kommera, Richard J. Oram, Phillip G. Rourke, Joshua W. Smith, Christopher C. Aschoff
  • Publication number: 20090096845
    Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 16, 2009
    Inventors: David M. Braun, Siddhartha Bhowmik, Swaroop K. Kommera, Richard J. Oram, Phillip G. Rourke, Joshua W. Smith, Christopher C. Aschoff
  • Patent number: 6917099
    Abstract: A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: July 12, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ronald A. Hellekson, Chien-Hua Chen, William R Boucher, Joshua W. Smith, David M Craig, Gary J. Watts
  • Patent number: 6869712
    Abstract: A method for roughening a surface of an ion exchange system structure using laser interaction with a surface. The laser surface roughening process allows the use of a wide range of substrates such as metals, ceramics, silicates, polymers and the like, including varieties which can not be fabricated in a fine fibrous structure. The surface roughened ion exchange system structure may be used as an ion-exchange media in applications such as fuel cells, batteries, and other catalysis systems where a high surface exchange area is desirable.
    Type: Grant
    Filed: March 7, 2002
    Date of Patent: March 22, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Laurie S. Mittelstadt, Joshua W. Smith
  • Patent number: 6791036
    Abstract: Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: September 14, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Yu Chen, Joel A. Gerber, Brian E. Schreiber, Joshua W. Smith
  • Publication number: 20030170519
    Abstract: A method for roughening a surface of an ion exchange system structure using laser interaction with a surface. The laser surface roughening process allows the use of a wide range of substrates such as metals, ceramics, silicates, polymers and the like, including varieties which can not be fabricated in a fine fibrous structure. The surface roughened ion exchange system structure may be used as an ion-exchange media in applications such as fuel cells, batteries, and other catalysis systems where a high surface exchange area is desirable.
    Type: Application
    Filed: March 7, 2002
    Publication date: September 11, 2003
    Inventors: Laurie S. Mittelstadt, Joshua W. Smith
  • Publication number: 20030136505
    Abstract: A method of preparing a surface for adhesion is provided. The method includes providing an initiator that is configured to shadow a portion of a surface of a substrate, directing a laser toward the surface of the substrate to effect ablation of a non-shadowed portion of the substrate, thus forming structures on the surface of the substrate. An adhesive then may be applied to the surface of the substrate.
    Type: Application
    Filed: January 18, 2002
    Publication date: July 24, 2003
    Inventors: Phillip L. Wimmer, Charles Otis, Joshua W. Smith
  • Patent number: 6063647
    Abstract: Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: May 16, 2000
    Assignee: 3M Innovative Properties Company
    Inventors: Yu Chen, Joel A. Gerber, Brian E. Schreiber, Joshua W. Smith