Patents by Inventor Joshua Wolanyk

Joshua Wolanyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250131776
    Abstract: Systems and methods for retaining data related to a detected collision are disclosed including receiving vehicle information from a sensor, receiving information about one or more other vehicles using a communication circuit, receiving an indication of a detected collision, and responsive to the received indication of the detected collision, storing information corresponding to the detected collision from a collision reenactment period in non-volatile memory of the first vehicle and broadcasting the information corresponding to the detected collision using the communication circuit.
    Type: Application
    Filed: July 26, 2024
    Publication date: April 24, 2025
    Inventor: Joshua Wolanyk
  • Patent number: 12040253
    Abstract: A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers above a conductor tier. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers. The channel-material strings directly electrically couple with conductor material of the conductor tier by conducting material that is in a lowest of the conductive tiers and that is directly against multiple of the channel-material strings. A through-array-via (TAV) region comprises TAVs that individually extend through the lowest conductive tier and into the conductor tier. Individual of the TAVs in the lowest conductive tier comprise a conductive core having an annulus circumferentially there-about. The annulus has dopant therein at a total dopant concentration of 0.01 to 30 atomic percent.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: July 16, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Alyssa N. Scarbrough, John D. Hopkins, Chet E. Carter, Justin D. Shepherdson, Collin Howder, Joshua Wolanyk
  • Publication number: 20230345722
    Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the methods includes forming levels of materials one over another; forming a first opening and a second opening in the levels of materials; forming at least one dielectric material in the first and second openings; forming tiers of materials over the levels of materials and over the dielectric material in the first and second openings; forming a first pillar of a memory cell string, the first pillar extending through the tiers of materials and extending partially into a location of the first opening; and forming a second pillar of a contact structure, the second pillar extending through the tiers of materials and through a location of the second opening.
    Type: Application
    Filed: April 22, 2022
    Publication date: October 26, 2023
    Inventors: Byeung Chul Kim, Joshua Wolanyk, Richard J. Hill, Damir Fazil
  • Publication number: 20230062403
    Abstract: A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers above a conductor tier. Strings of memory cells comprise channel-material strings that extend through the insulative tiers and the conductive tiers. The channel-material strings directly electrically couple with conductor material of the conductor tier by conducting material that is in a lowest of the conductive tiers and that is directly against multiple of the channel-material strings. A through-array-via (TAV) region comprises TAVs that individually extend through the lowest conductive tier and into the conductor tier. Individual of the TAVs in the lowest conductive tier comprise a conductive core having an annulus circumferentially there-about. The annulus has dopant therein at a total dopant concentration of 0.01 to 30 atomic percent.
    Type: Application
    Filed: October 22, 2021
    Publication date: March 2, 2023
    Applicant: Micron Technology, Inc.
    Inventors: Alyssa N. Scarbrough, John D. Hopkins, Chet E. Carter, Justin D. Shepherdson, Collin Howder, Joshua Wolanyk