Patents by Inventor Joshua Ziff

Joshua Ziff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERCONNECT AND SYSTEM INCLUDING SAME
    Publication number: 20100258348
    Abstract: An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall.
    Type: Application
    Filed: April 6, 2010
    Publication date: October 14, 2010
    Applicant: Bridge Semiconductor Corporation
    Inventors: Joshua Ziff, Joseph R. Acquaviva, Chien Hung Wu, William Jan, Charles Buenzli, Nelson Kuan