Patents by Inventor Josiah CHAN

Josiah CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ENCAPSULANTS TO RETAIN WIRES AT BOND PADS
    Publication number: 20170182786
    Abstract: An example device in accordance with an aspect of the present disclosure includes a sensor die having a sensitive region and a bond pad. A bond is formed between a wire and the bond pad of the sensor die. An encapsulant is to retain the wire at the bond pad and mechanically support the wire and the bond, based on covering the bond and wire according to an encapsulant height, extending from the bond pad, greater than a bond height. The encapsulant is localized at the bond pad of the sensor die to enable the sensitive region to remain uncovered by the encapsulant.
    Type: Application
    Filed: February 4, 2014
    Publication date: June 29, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.
    Inventors: Emilio Angulo Navarro, Josiah CHAN, Fernando Bayona Alcolea, Albert Crespi Serrano, Mikel Zuza Irurueta, Jorge Castano, Ying Ying HO