Patents by Inventor Josiane Léon

Josiane Léon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS
    Publication number: 20230193106
    Abstract: The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m.K measured according to ASTM D7984) and a volume resistivity of at least 10 ?·m (measured according to ASTM D257) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m·K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.
    Type: Application
    Filed: January 20, 2021
    Publication date: June 22, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Liang Ma, Marvin M. Pollum, Jr., Calum H. Munro, Maria S. French, Allison G. Condie, Fabien Mezzanotti, Josiane Léon, Hong Li
  • COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS
    Publication number: 20220267563
    Abstract: The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m K (measured according to ASTM D7984) and a volume resistivity of at least 10 ?m (measured according to ASTM D257, C611, or B 193) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m·K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.
    Type: Application
    Filed: July 15, 2020
    Publication date: August 25, 2022
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Fabien Mezzanotti, Josiane Léon, Liang Ma, Allison G. Condie, Maria S. French
  • Reactive hot melt adhesive
    Patent number: 7271202
    Abstract: The invention is a reactive hot melt composition which has excellent adhesion and curing properties, and can be formulated into free-flowing pellets or beads, by using an ethylene-acrylic acid copolymer, and athylene-methacrylic acid copolymer, and/or an ethylene-acrylic acid methacrylic acid terpolymer as a component of the composition along with free radical crosslinking initiators. The incorporation of a foaming agent enables the production of compositions which are useful in space-filling applications, (i.e., as so-called “anti-flutter” compositions).
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: September 18, 2007
    Assignee: Dow Global Technologies Inc.
    Inventors: Franciscus J. T. Krabbenborg, Marc A. Mangnus, Philippe C. Belot, Josiane Leon
  • Reactive hot melt adhesive
    Publication number: 20040260012
    Abstract: The invention is a reactive hot melt composition which has excellent adhesion and curing properties, and can be formulated into free-flowing pellets or beads, by using an ethylene-acrylic acid copolymer, and athylene-methacrylic acid copolymer, and/or an ethylene-acrylic acid methacrylic acid terpolymer as a component of the composition along with free radical crosslinking initiators. The incorporation of a foaming agent enables the production of compositions which are useful in space-filling applications, (i.e., as so-called “anti-flutter” compositions).
    Type: Application
    Filed: February 23, 2004
    Publication date: December 23, 2004
    Inventors: Franciscus J.T. Krabbenborg, Marc A. Mangnus, Philippe C. Belot, Josiane Leon