Abstract: An aqueous alkaline bath is disclosed, for the adhesive chemical (electroless) deposition of copper, nickel, cobalt or their alloys with great purity, containing compounds of these metals, reducing agent, wetting agent, pH-regulating substance, stabilizer, inhibitor and complex former, characterized in that polyols and/or compounds of the biuret type are contained as complex former, as well as a method for the adhesive chemical deposition of the metals, employing this bath at a temperature from 5.degree. C. up to the boiling point of the bath, particularly for the manufacture of printed circuits.

Abstract: The specification discloses an improvement in the electrodeposition of silver from an aqueous cyanide-free bath which comprises the use organic nitrogen containing compounds having at least two nitrogen atoms and having a molecular weight of at least 300, and a compound of sulfur or selenium in which the sulfur or selenium is in an oxidation state of minus one or minus two. The combination is used as an activator in the bath.

Abstract: A cyanide-free bath for the galvanic separation of rare-metal alloys in which a rare metal is present in the form of a thiosulphate compound. The rare metal may be gold and/or silver, and/or palladium. The rare metal is present in concentrations of 0.01 to 70 g/liter.