Abstract: A flat-packing machine for producing a package of compressed innerspring units comprises a press device having a first pressing tool and a second pressing tool. The press device is configured to compress an innerspring unit between the first pressing tool and the second pressing tool while one of the first pressing tool and the second pressing tool holds one or more further previously compressed innerspring units in a compressed state.

Abstract: A semiconductor radiation source includes at least one semiconductor chip that generates radiation; and at least one capacitor body, wherein the semiconductor chip and the capacitor body are stacked on top of each other, the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the semiconductor chip is a ridge waveguide laser, and a ridge waveguide of the semiconductor chip is arranged on a side of the semiconductor chip facing away from the capacitor body.

Abstract: A flat-packing machine for producing a package of compressed innerspring units comprises a press device having a first pressing tool and a second pressing tool. The press device is configured to compress an innerspring unit between the first pressing tool and the second pressing tool while one of the first pressing tool and the second pressing tool holds one or more further previously compressed innerspring units in a compressed state.

Abstract: A flat-packing machine for producing a package of compressed innerspring units (10) comprises a press device having a first pressing tool (210) and a second pressing tool (220). The press device is configured to compress an innerspring unit (10) between the first pressing tool (210) and the second pressing tool (220) while one of the first pressing tool (210) and the second pressing tool (220) holds one or more further previously compressed innerspring units (10) in a compressed state.

Abstract: A semiconductor radiation source includes at least one semiconductor chip that generates radiation; and at least one capacitor body, wherein the semiconductor chip and the capacitor body are stacked on top of each other, the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the semiconductor chip is a ridge waveguide laser, and a ridge waveguide of the semiconductor chip is arranged on a side of the semiconductor chip facing away from the capacitor body.

Abstract: A semiconductor radiation source includes at least one semiconductor chip that generates radiation; a controller with one or more switching elements configured for pulsed operation of the semiconductor chip; and at least one capacitor body, wherein the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the controller electrically connects to a side of the semiconductor chip opposite the capacitor body, and the controller, the capacitor body and the semiconductor chip are stacked on top of each other so that the capacitor body is located between the control unit and the semiconductor chip.

Abstract: A driver circuit for at least one light-emitting optoelectronic component includes a control circuit having a capacitor and a control switch, wherein the control switch electrically connects to the component such that the component is supplied with current by the capacitor as a function of a switching state of the control switch, and a charging circuit having at least a first charging switch, a bias resistor and a buffer capacitor, wherein the charging circuit electrically connects to the capacitor and is configured to charge the capacitor through the bias resistor, and the buffer capacitor is linked to a connecting line between the bias resistor and the capacitor.

Abstract: A semiconductor laser includes a contact carrier having electrical contact surfaces to electrically contact a semiconductor layer sequence, an electrical connecting line from a main side of the semiconductor layer sequence facing away from the contact carrier and a plurality of capacitors, wherein the connecting line is located on or in the semiconductor layer sequence, at least two of the capacitors are present, the capacitances of which differ by at least a factor of 50, the capacitor having a smaller capacitance is configured to supply the active zone with current immediately after a switch-on operation, and the capacitor having the larger capacitance is configured to a subsequent current supply, the capacitor having the smaller capacitance directly electrically connects to the active zone, and a resistor is arranged between the capacitor having the larger capacitance and the active zone, the resistor having a resistance of at least 100 ?.

Abstract: A semiconductor radiation source includes at least one semiconductor chip that generates radiation; a controller with one or more switching elements configured for pulsed operation of the semiconductor chip; and at least one capacitor body, wherein the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the controller electrically connects to a side of the semiconductor chip opposite the capacitor body, and the controller, the capacitor body and the semiconductor chip are stacked on top of each other so that the capacitor body is located between the control unit and the semiconductor chip.

Abstract: An electrical circuit that drives a light-emitting component including a parallel circuit including a capacitor; and a switching element, wherein a first terminal for a voltage supply connects to a first contact of the capacitor and a second terminal for a voltage supply connects to a second contact of the capacitor, the switching element includes a first electrical switch including a first input for a first switching signal, a second electrical switch including a second input for a second switching signal, and third and fourth terminals, the third terminal and the fourth terminal form a component terminal for the light-emitting component, a first current path may be switched to be conducting by the first switch, the first current path includes the component terminal, a second current path may be switched to be conducting by the second switch, and the second current path is in parallel with the component terminal.

Abstract: A flat-packing machine for producing a package of compressed innerspring units (10) comprises a press device having a first pressing tool (210) and a second pressing tool (220). The press device is configured to compress an innerspring unit (10) between the first pressing tool (210) and the second pressing tool (220) while one of the first pressing tool (210) and the second pressing tool (220) holds one or more further previously compressed innerspring units (10) in a compressed state.

Abstract: A driver circuit for at least one light-emitting optoelectronic component includes a control circuit having a capacitor and a control switch, wherein the control switch electrically connects to the component such that the component is supplied with current by the capacitor as a function of a switching state of the control switch, and a charging circuit having at least a first charging switch, a bias resistor and a buffer capacitor, wherein the charging circuit electrically connects to the capacitor and is configured to charge the capacitor through the bias resistor, and the buffer capacitor is linked to a connecting line between the bias resistor and the capacitor.

Abstract: A laser module includes a housing with a cavity and a window opening, a side-emitting semiconductor laser diode, arranged in the cavity that emits light radiation in the form of a laser beam, an optical deflection structure that deflects the laser beam, emitted by the semiconductor laser diode, in a direction of the window opening, and an optical output coupling structure arranged in the region of the window opening to output couple the laser beam in a defined direction and/or with a defined emission profile, wherein the optical deflection structure and the optical output coupling structure are configured in one piece in the form of a shared optical component.

Abstract: A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.

Abstract: A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least. in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.

Abstract: The present invention is directed to opening a spring roll pack in a controlled manner. A support surface is provided that is positioned to support the spring roll pack. A compression mechanism compresses the spring roll pack. As the spring roll pack is compressed, the spring roll pack is rotated while an accumulator winds wrapping material of the spring roll pack.

Abstract: Circuit arrangements for the operation of a pulse laser diode and methods for operating a pulse laser diode include a current source to supply a direct current to the pulse laser diode. The circuit arrangement can provide operation of the pulse laser diode that can be stable and without unintentional shifts in wavelength.

Abstract: The present invention is directed to opening a spring roll pack in a controlled manner. A support surface is provided that is positioned to support the spring roll pack. A compression mechanism compresses the spring roll pack. As the spring roll pack is compressed, the spring roll pack is rotated while an accumulator winds wrapping material of the spring roll pack.

Abstract: In a surface emitting semiconductor laser comprising a semiconductor chip (1), a first resonator mirror (4) and at least one further resonator mirror (8) which is arranged outside the semiconductor chip (1) and forms with the first resonator mirror (4) a laser resonator having a resonator length L and a pump laser (10) which, for optically pumping the semiconductor laser (1), radiates pump radiation (14) having a pump power into the semiconductor chip (1), the pump power is modulated with a modulation frequency fp and the resonator length L is adapted to the modulation frequency fp.

Abstract: Circuit arrangements for the operation of a pulse laser diode and methods for operating a pulse laser diode include a current source to supply a direct current to the pulse laser diode. The circuit arrangement can provide operation of the pulse laser diode that can be stable and without unintentional shifts in wavelength.