Patents by Inventor Jou-Yin Liu

Jou-Yin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Novel formation of an aluminum contact pad free of plasma induced damage by applying CMP
    Publication number: 20040175918
    Abstract: A new method is provided for the creation of an aluminum contact pad. A layer of passivation is created over the surface of a substrate, an opening is created through the layer of passivation. A layer of aluminum is deposited over the surface of the deposited layer of passivation, filling the opening that has been created there-through. The deposited layer of aluminum is then polished down to the surface of the layer of passivation, leaving the deposited aluminum in place inside the opening created through the layer of passivation for purposes of serving as a contact pad.
    Type: Application
    Filed: March 5, 2003
    Publication date: September 9, 2004
    Applicant: Taiwan Semiconductor Manufacturing Company
    Inventors: Pao-Kang Niu, Shui-Hung Chen, Mu-Chi Chiang, Jou-Yin Liu, Harry Chuang