Patents by Inventor Joung Ah Kang

Joung Ah Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
    Patent number: 8530749
    Abstract: Provided is an ultra-thin copper foil to which a carrier foil is attached, including: a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer includes a first metal A having peelability, a second metal B and a third metal C facilitating coating of the first metal, wherein the amount (a) of the first metal A is in a range of about 30 to about 89% by total weight of the peeling layer, the amount (b) of the second metal B is in a range of about 10 to about 60% by total weight of the peeling layer, and the amount (c) of the third metal C is in a range of about 1 to about 20% by total weight of the peeling layer.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: September 10, 2013
    Assignee: Iljin Copper Foil Co., Ltd.
    Inventors: Jong Ho Ryu, Chang Yol Yang, Joung Ah Kang
  • COPPER FOIL ATTACHED TO THE CARRIER FOIL, A METHOD FOR PREPARING THE SAME AND PRINTED CIRCUIT BOARD USING THE SAME
    Publication number: 20100282500
    Abstract: Provided is an ultra-thin copper foil to which a carrier foil is attached, including: a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer includes a first metal A having peelability, a second metal B and a third metal C facilitating coating of the first metal, wherein the amount (a) of the first metal A is in a range of about 30 to about 89% by total weight of the peeling layer, the amount (b) of the second metal B is in a range of about 10 to about 60% by total weight of the peeling layer, and the amount (c) of the third metal C is in a range of about 1 to about 20% by total weight of the peeling layer.
    Type: Application
    Filed: December 23, 2008
    Publication date: November 11, 2010
    Applicant: ILJIN COPPER FOIL CO., LTD.
    Inventors: Jong Ho Ryu, Chang Yol Yang, Joung Ah Kang