Patents by Inventor Joung-Gul Ryu
Joung-Gul Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923124Abstract: A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.Type: GrantFiled: August 2, 2019Date of Patent: March 5, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Jae Hun Kim, Joung Gul Ryu, Byung Soo Kang, Byeong Cheol Moon, Jeong Gu Yeo
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Publication number: 20240006118Abstract: A coil component includes a nonmagnetic body having a cured product of a polymer resin, an insulating substrate embedded in the body and having a thickness of 30 ?m or less, a coil portion including first and second coil patterns respectively disposed on first and second opposing surfaces of the insulating substrate, and first and second external electrodes disposed on a surface of the body to be connected to each of the first and second coil patterns exposed to the surface of the body.Type: ApplicationFiled: September 18, 2023Publication date: January 4, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hyung Jung, Byeong Cheol Moon, Joung Gul Ryu
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Patent number: 11862386Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a thickness direction of the body and including a core formed in the thickness direction; a coil part embedded in the body and including at least one turn around the core; an insulating layer disposed on the first surface of the body; a bonded conductive layer disposed on the insulating layer and having a surface roughness of the first surface which is in contact with the insulating layer greater than a surface roughness of the second surface opposing the first surface of the bonded conductive layer; and external electrodes connected to the coil part and covering the bonded conductive layer.Type: GrantFiled: August 11, 2021Date of Patent: January 2, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Soo Kang, Byeong Cheol Moon, Joung Gul Ryu, Ju Hwan Yang
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Patent number: 11830662Abstract: A coil component includes a support substrate; first and second coil portions, respectively arranged on the support substrate; a body embedding the support substrate and the first and second coil portions therein; first and second lead-out portions, respectively connected to end portions of the first and second coil portions and exposed from one surface to be spaced apart from each other; and first and second connection portions, respectively connecting the end portions of the first and second coil portions to the first and second lead-out portions, wherein a line width of one end of each of the first and second connection portions connected to the respective end portion of the first and second coil portions is smaller than a line width of another end of each of the first and second connection portions connected to a respective one of the first and second lead-out portions.Type: GrantFiled: January 22, 2020Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon, Joung Gul Ryu
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Patent number: 11830655Abstract: A coil component includes a body, a support substrate disposed in the body, and a coil portion including a first coil pattern on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the body, and a second lead-out pattern disposed on the one surface of the support substrate to be spaced apart from the first coil pattern and extending to another end surface of the body. A reinforcing pattern portion is disposed between each lead-out pattern and the one surface of the support substrate, first and second slit portions are disposed in edge portions of the body and respectively expose the first and second lead-out patterns, and first and second external electrodes are respectively disposed on the inner surfaces of the first and second slit portions and respectively connected to the first and second lead-out patterns.Type: GrantFiled: August 11, 2020Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Joung Gul Ryu, Ji Man Ryu, Byung Soo Kang, Byeong Cheol Moon
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Patent number: 11721473Abstract: A coil component includes a body, an insulating substrate embedded in the body and including an insulating resin, and first and second substrate protection layers covering respective surfaces of the insulating substrate to protect the insulating substrate and including a ceramic. A coil portion includes first and second coil patterns respectively disposed on the first and second substrate protection layers. Each of the first and second coil patterns includes a first conductive layer, disposed on the respective first or second substrate protection layer, and a second conductive layer disposed on the first conductive layer to expose a side surface of the first conductive layer.Type: GrantFiled: August 26, 2019Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joung Gul Ryu, Ji Man Ryu, Byeong Cheol Moon
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Patent number: 11721475Abstract: A coil component includes a body; a support substrate embedded in the body; and a coil portion disposed on the support substrate and embedded in the body, and including a lead-out pattern disposed on one surface of the support substrate, and an auxiliary lead-out pattern disposed on the other surface of the support substrate and corresponding to the lead-out pattern. The auxiliary lead-out pattern includes an external surface exposed from a surface of the body and an internal surface opposing the external surface, and the body includes an anchor portion disposed inside the auxiliary lead-out pattern.Type: GrantFiled: October 30, 2019Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joung Gul Ryu, Ju Hwan Yang
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Patent number: 11664154Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body, in which the support substrate and the coil portion are embedded, having one surface and the other surface, one side surface and the other side surface, and one end surface and the other end surface, a first lead-out portion and a second lead-out portion, respectively extending from the coil portion to be exposed from the one side surface and the other side surface, an insulating layer disposed on each of the one surface and the other surface, and an oxide insulating layer disposed on each of the one side surface and the other side surface and each of the one end surface and the other end surface. The insulating layer is provided with a plurality of slits spaced apart from each other to expose a surface of the body.Type: GrantFiled: November 26, 2019Date of Patent: May 30, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Seo Eun Kim, Byung Soo Kang, Byeong Cheol Moon, Joung Gul Ryu
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Patent number: 11574765Abstract: A coil component includes a body having one surface and the other surface facing each other, and having one end surface and the other end surface facing each other in one direction; a supporting substrate embedded in the body; a coil portion disposed on the supporting substrate; a first lead-out portion connected to one end of the coil portion and exposed from the body; and a second lead-out portion connected to the other end of the coil portion and exposed from the body. The coil portion has a first pattern region facing the one surface and a second pattern region facing the other surface, each of the first and second pattern regions extends in the one direction, and a distance of the first pattern region in the one direction is shorter than a distance of the second pattern region in the one direction.Type: GrantFiled: August 2, 2019Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hyung Jung, Byeong Cheol Moon, Jae Hun Kim, Joung Gul Ryu
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Patent number: 11488762Abstract: A chip inductor includes a body having a coil and an insulating member on which the coil is disposed, and external electrodes disposed on external surfaces of the body. The insulating layers are disposed on one surface of the insulating member in the body and another surface opposing the one surface, respectively, and are made of a material different from a material of the insulating member. The insulating member and the insulating layers constitute a multilayer structure. The coil includes a top coil and a bottom coil disposed on a top surface and a bottom surface of the multilayer structure, respectively. The top and bottom coils are connected by a via penetrating through the top and bottom surfaces of the multilayer structure.Type: GrantFiled: March 11, 2019Date of Patent: November 1, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joung Gul Ryu, Mi Geum Kim
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Patent number: 11398343Abstract: A coil component is disclosed. The coil component includes a body having one surface and the other surface opposing each other, and a plurality of wall surfaces connecting one surface and the other surface to each other; a coil part embedded in the body and having both ends exposed to both end surfaces of the plurality of wall surfaces of the body, opposing each other; an insulating layer covering one surface of the body; and first and second external electrodes disposed on both end surfaces of the body, respectively, to extend onto the insulating layer, and including a bonded conductive layer disposed on the insulating layer, and an external conductive layer disposed on the bonded conductive layer, respectively.Type: GrantFiled: October 16, 2018Date of Patent: July 26, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Byeong Cheol Moon, Joung Gul Ryu
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Patent number: 11380475Abstract: A coil component includes a body including a magnetic metal powder; an internal insulating layer buried in the body; an internal coil portion disposed on the internal insulating layer, and having turns of which cross-sectional areas increase towards the internal insulating layer from externally of the internal insulating layer; an external insulating layer covering the internal coil portion; an external coil portion disposed on the external insulating layer, and having a greater number of turns than a number of turns of the internal coil portion; a connection via penetrating through the external insulating layer and connecting the internal coil portion and the external coil portion; and an insulating film surrounding the internal insulating layer, the internal coil portion, the external insulating layer, and the external coil portion.Type: GrantFiled: March 5, 2019Date of Patent: July 5, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Geum Kim, Byeong Cheol Moon, Joung Gul Ryu
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Publication number: 20210375530Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a thickness direction of the body and including a core formed in the thickness direction; a coil part embedded in the body and including at least one turn around the core; an insulating layer disposed on the first surface of the body; a bonded conductive layer disposed on the insulating layer and having a surface roughness of the first surface which is in contact with the insulating layer greater than a surface roughness of the second surface opposing the first surface of the bonded conductive layer; and external electrodes connected to the coil part and covering the bonded conductive layer.Type: ApplicationFiled: August 11, 2021Publication date: December 2, 2021Inventors: Byung Soo KANG, Byeong Cheol MOON, Joung Gul RYU, Ju Hwan YANG
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Publication number: 20210350971Abstract: A coil component includes a support substrate, a coil portion disposed on the support substrate, and a body in which the support substrate and the coil portion are disposed. The coil portion includes a coil pattern portion, a lower pattern portion connected to the coil pattern portion and disposed on one surface of the support substrate, a dummy pattern portion disposed to overlap the lower pattern portion on another surface of the support substrate opposite to the one surface, and a through-via penetrating through the support substrate and connecting the lower pattern portion and the dummy pattern portion to each other. The lower pattern portion and the dummy pattern portion are externally exposed through one surface of the body. The through-via has one surface externally exposed through the one surface of the body.Type: ApplicationFiled: August 11, 2020Publication date: November 11, 2021Inventors: Joung Gul Ryu, Byeong Cheol Moon
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Publication number: 20210335532Abstract: A coil component includes a body, a support substrate disposed in the body, and a coil portion including a first coil pattern on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the body, and a second lead-out pattern disposed on the one surface of the support substrate to be spaced apart from the first coil pattern and extending to another end surface of the body. A reinforcing pattern portion is disposed between each lead-out pattern and the one surface of the support substrate, first and second slit portions are disposed in edge portions of the body and respectively expose the first and second lead-out patterns, and first and second external electrodes are respectively disposed on the inner surfaces of the first and second slit portions and respectively connected to the first and second lead-out patterns.Type: ApplicationFiled: August 11, 2020Publication date: October 28, 2021Inventors: Ju Hwan Yang, Joung Gul Ryu, Ji Man Ryu, Byung Soo Kang, Byeong Cheol Moon
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Patent number: 11158453Abstract: A coil component includes: a body having one surface and the other surface opposing each other in one direction; a coil portion including a coil pattern embedded in the body and having at least one turn in the one direction; an insulating layer surrounding the body; an external electrode connected to the coil portion, penetrating through he insulating layer, and disposed on the one surface of the body; a shielding layer disposed on the insulating layer and disposed at least on the other surface of the body opposing the one surface of the body; and a seed layer disposed between the insulating layer and the shielding layer.Type: GrantFiled: September 10, 2018Date of Patent: October 26, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Soo Kang, Joung Gul Ryu, Byeong Cheol Moon, Yong Hui Li
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Patent number: 11145452Abstract: An inductor includes a body including a support member, a coil, and an encapsulant, and external electrodes on external surfaces of the body. The coil in the body may be formed so that a plurality of coil patterns are continuously formed, wherein the coil pattern includes first and second coil layers, and the encapsulant extends downward between adjacent coil patterns to be between first coil layers of adjacent coil patterns.Type: GrantFiled: November 22, 2017Date of Patent: October 12, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Boum Seock Kim, Byeong Cheol Moon, Kang Wook Bong, Young Min Hur, Joung Gul Ryu
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Patent number: 11127523Abstract: An inductor includes a body including a support member, a coil, and an encapsulant encapsulating the support member and the coil and external electrodes disposed on an external surface of the body and connected to the coil, wherein the support member includes a through-hole and a via hole spaced apart from the through-hole, the coil includes a first coil disposed on one surface of the support member and a second coil disposed on the other surface of the support member opposing the one surface, the first and second coils are connected to each other by a via filling the via hole, and the via continuously covers an end surface of the first coil and an upper surface of the second coil.Type: GrantFiled: November 1, 2018Date of Patent: September 21, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Geum Kim, Byeong Cheol Moon, Joung Gul Ryu
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Patent number: 11107622Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a thickness direction of the body and including a core formed in the thickness direction; a coil part embedded in the body and including at least one turn around the core; an insulating layer disposed on the first surface of the body; a bonded conductive layer disposed on the insulating layer and having a surface roughness of the first surface which is in contact with the insulating layer greater than a surface roughness of the second surface opposing the first surface of the bonded conductive layer; and external electrodes connected to the coil part and covering the bonded conductive layer.Type: GrantFiled: October 18, 2018Date of Patent: August 31, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Soo Kang, Byeong Cheol Moon, Joung Gul Ryu, Ju Hwan Yang
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Patent number: 11094458Abstract: A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer.Type: GrantFiled: November 30, 2017Date of Patent: August 17, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kang Wook Bong, Byeong Cheol Moon, Boum Seock Kim, Jin Hyuk Jang, Joung Gul Ryu