Abstract: A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes.

Abstract: An apparatus for preparing a catalyst for carbon nanotubes using spray pyrolysis and a method for preparing the catalyst are disclosed. The apparatus comprises a plurality of raw material tanks, an agitator to mix raw materials respectively supplied from the raw material tanks, a drier to spray the mixture supplied from the agitator and thus to heat and bake the same, and a storage to store a dried material discharged from the drier. The method comprises supplying a plurality of raw materials, mixing the raw materials with one another, spraying the raw material mixture in a liquid state and drying the same at a high temperature, and storing a catalyst generated in the drying process.

Abstract: An apparatus for preparing a catalyst for carbon nanotubes using spray pyrolysis and a method for preparing the catalyst are disclosed. The apparatus comprises a plurality of raw material tanks, an agitator to mix raw materials respectively supplied from the raw material tanks, a drier to spray the mixture supplied from the agitator and thus to heat and bake the same, and a storage to store a dried material discharged from the drier. The method comprises supplying a plurality of raw materials, mixing the raw materials with one another, spraying the raw material mixture in a liquid state and drying the same at a high temperature, and storing a catalyst generated in the drying process.

Abstract: A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes.