Abstract: An antenna device includes an antenna array including a plurality of first antenna elements, arranged in a 2-by-2 array, a plurality of second antenna elements arranged in a 2-by-2 array, a first switching circuit, a second switching circuit connected to the first switching circuit and the first antenna elements, a third switching circuit connected to the first switching circuit and the second antenna elements, and a processor connected to the switching circuits. The processor is configured to control at least one of the switching circuits to operate in a single mode, among the plurality of modes, based on a single beam pattern among a plurality of predetermined beam patterns and to feed power to the antenna array through the first switching circuit, the second switching circuit, and the third switching circuit, to transmit a signal having the beam pattern.

Abstract: A radio frequency integrated circuit (RFIC) includes a transmitting circuit configured to provide a first signal for transmission by an antenna in a transmitting mode, the transmitting circuit including a coil configured to be coupled to the antenna and at least one mode setting circuit configured to activate a resonant circuit including at least a portion of the coil in a receiving mode. The RFIC further includes a receiving circuit configured to receive a second signal received from the antenna in the receiving mode. Related wireless communication devices and communication circuits are provided.

Abstract: A wireless communication device for transceiving signals by using carrier aggregation is provided. The wireless communication device includes a first antenna configured to transmit a first signal to an outside of the wireless communication device or receive a second signal from the outside; a first transmitter connected to the first antenna via a first node and configured to generate the first signal by combining plural transmitting carrier signals received over a plural transmitting carriers; and a first receiver connected to the first antenna via the first node and configured to divide the second signal into a plural receiving carrier signals received over a plural receiving carriers. The first receiver includes a first receiving amplifier commonly connected to a plural carrier receivers configured to amplify the second signal received from the first antenna and to divide the receiving carrier signals, respectively.

Abstract: A radio frequency integrated circuit (RFIC) includes a transmitting circuit configured to provide a first signal for transmission by an antenna in a transmitting mode, the transmitting circuit including a coil configured to be coupled to the antenna and at least one mode setting circuit configured to activate a resonant circuit including at least a portion of the coil in a receiving mode. The RFIC further includes a receiving circuit configured to receive a second signal received from the antenna in the receiving mode. Related wireless communication devices and communication circuits are provided.

Abstract: A wireless communication device for transceiving signals by using carrier aggregation is provided. The wireless communication device includes a first antenna configured to transmit a first signal to an outside of the wireless communication device or receive a second signal from the outside; a first transmitter connected to the first antenna via a first node and configured to generate the first signal by combining plural transmitting carrier signals received over a plural transmitting carriers; and a first receiver connected to the first antenna via the first node and configured to divide the second signal into a plural receiving carrier signals received over a plural receiving carriers. The first receiver includes a first receiving amplifier commonly connected to a plural carrier receivers configured to amplify the second signal received from the first antenna and to divide the receiving carrier signals, respectively.

Abstract: A transceiver includes a transmitter circuit, a receiver circuit, and the loopback switch. The transmitter circuit performs a digital-to-analog conversion (DAC) operation on a calibration code without a transmission digital signal in a calibration mode to generate a calibration signal. The transmitter circuit up-converts the calibration signal and generates a transmission signal. The receiver circuit down-converts the transmission signal in the calibration mode and generates a receiving digital signal. The loopback switch electrically connects an output terminal of the transmitter circuit and an input terminal of the receiver circuit in the calibration mode. Thus, the transceiver may stably reduce a carrier leakage irrespective of processes, voltages, and temperatures.

Abstract: A transceiver includes a transmitter circuit, a receiver circuit, and the loopback switch. The transmitter circuit performs a digital-to-analog conversion (DAC) operation on a calibration code without a transmission digital signal in a calibration mode to generate a calibration signal. The transmitter circuit up-converts the calibration signal and generates a transmission signal. The receiver circuit down-converts the transmission signal in the calibration mode and generates a receiving digital signal. The loopback switch electrically connects an output terminal of the transmitter circuit and an input terminal of the receiver circuit in the calibration mode. Thus, the transceiver may stably reduce a carrier leakage irrespective of processes, voltages, and temperatures.

Abstract: A multi-layer dielectric resonant device has a dielectric resonator and a microstrip line to be coupled to the dielectric resonator. The dielectric resonator includes a first dielectric layer, a second dielectric layer, a third dielectric layer, a metallic substrate and a metallic plate. The second dielectric layer is placed on the first dielectric layer and has a dielectric constant higher than that of the first dielectric layer. The third dielectric layer is placed on the second dielectric layer and has a dielectric constant lower than that of the second dielectric layer. The metallic substrate is placed in the center portion of the second dielectric constant layer to reduce the conductor loss of the dielectric resonator. The metallic plate constitutes the outer wall of the dielectric resonator.

Abstract: A resonating apparatus includes a dielectric resonator on a dielectric supporting substrate, a fluid dielectric membrane which overspreads the dielectric resonator, and a microstrip line which is arranged in the fluid substrate membrane so that it is coupled with the dielectric resonator. The resonating apparatus reduces the conductivity loss by lengthening the distance between the dielectric supporting substrate in the higher layer and the microstrip line in the lower layer when it is used in a multi-layer circuit such as an MMIC. Further, the resonating apparatus increases the dielectric permittivity by using the dielectric resonator which has high dielectric permittivity as well as the fluid dielectric membrane. In this way, the resonating apparatus obtains high Q.

Abstract: A resonating apparatus in accordance with the present invention comprises a dielectric resonator on a dielectric supporting substrate, a fluid dielectric membrane which overspreads the dielectric resonator, and a microstrip line which is arranged in the fluid substrate membrane so that it is coupled with the dielectric resonator. The resonating apparatus reduces the conductivity loss by lengthening the distance between the dielectric supporting substrate in the higher layer and the microstrip line in the lower layer when it is used in a multiplayer circuit or a MMIC. Further, the resonating apparatus increases the dielectric permittivity by using the dielectric resonator which has high dielectric permittivity and futher including the fluid dielectric membrane. In this way, the resonating apparatus obtains high Q.