Abstract: The present disclosure provides a method and device for forming a plate to have a hat shape that protrudes from a bottom surface to a certain height and has a flat surface on an upper portion. In one aspect, the method comprises a) forming a plate to have a protrusion shape having a curved surface on an upper portion such that a thickness reduction rate of the plate is substantially uniform; b) forming corner portions at both ends of the plate by moving the plate whereby the protrusion portion of the plate has a substantially flat surface; and c) forming a flat surface by correcting protruding portions in the corner portions at both ends to make the protruding portions flat.

Abstract: A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch and a second ring oscillator connected to the first node through a second supply switch and the second node through a second ground switch, wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator.

Abstract: Provided is an eco-friendly ceiling panel apparatus mountable on the ceiling of a building, and a method of manufacturing the same, the ceiling panel apparatus including a base substantially having a rectangular plate shape and made of a first material, and one or more reinforcing members substantially having a rod shape, made of a second material, and provided in the base to prevent sagging of the base, wherein the reinforcing members are disposed in a diagonal direction of the base.

Abstract: A display device may include a display region and a non-display region disposed on a substrate, a pixel including a plurality of sub-pixels disposed in the display region, and a power line disposed between each of sub-pixels. A light-emitting element may be disposed on the power line, and the light-emitting element may be electrically connected to a first connection electrode. Each sub-pixel may include a plurality of transistors, and a second connection electrode may be connected to a driving transistor among the plurality of transistors.

Abstract: In some aspects, the disclosure is directed to methods and systems for providing a hybrid low power, high bandwidth media transport protocol between media sinks and media sources by splitting control and synchronization commands to a low power communication interface, and media data to a high bandwidth unidirectional communication interface. Media sinks need not transmit via the high bandwidth unidirectional communication interface, reducing power consumption, which may be particularly beneficial for small devices with limited battery capacity such as wireless earbuds.