Abstract: A die attaching method for attaching semiconductor dies on wafers, each wafer having a first center point and a first radius may include expanding a wafer carrier tape so that the wafer has a second center point and a second radius, measuring the second center point and second radius of the wafer, adding the difference between the first radius and the second radius to a first coordinate value of a first die to calculate a second coordinate value of the first die, and picking up and attaching the semiconductor dies consecutively from the first die. Calculating the second coordinate value of the first die may include compensating the first center point of the wafer based on the second center point of the wafer to calculate the positional coordinate of the semiconductor dies including the first die.

Abstract: A die attaching method for attaching semiconductor dies on wafers, each wafer having a first center point and a first radius may comprise expanding a wafer carrier tape so that the wafer has a second center point and a second radius, measuring the second center point and second radius of the wafer, adding the difference between the first radius and the second radius to a first coordinate value of a first die to calculate a second coordinate value of the first die, and picking up and attaching the semiconductor dies consecutively from the first die. Calculating the second coordinate value of the first die may include compensating the first center point of the wafer based on the second center point of the wafer to calculate the positional coordinate of the semiconductor dies including the first die.

Abstract: A wafer sawing apparatus comprises an electrically conductive chuck table surrounding a suction plate and tactile sensing lines formed on the upper surface of the suction plate. At least one end of each tactile sensing line is electrically connected to the table body. A controller controls the chuck table and a scribing blade. The controller is electrically connected to both elements. The controller comprises a tactile sensing unit connected to the table body for sensing contact of the scribing blade with the tactile sensing lines or the table body and an equipment stop unit for stopping the scribing blade. The controller further comprises a zero point adjusting unit for receiving a contact signal from the tactile sensing unit and for adjusting a zero point of the scribing blade, and a switching unit connecting the tactile sensing unit to the zero point adjusting unit or the equipment stop unit.

Abstract: A wafer sawing apparatus comprises an electrically conductive chuck table surrounding a suction plate and tactile sensing lines formed on the upper surface of the suction plate. At least one end of each tactile sensing line is electrically connected to the table body. A controller controls the chuck table and a scribing blade. The controller is electrically connected to both elements. The controller comprises a tactile sensing unit connected to the table body for sensing contact of the scribing blade with the tactile sensing lines or the table body and an equipment stop unit for stopping the scribing blade. The controller further comprises a zero point adjusting unit for receiving a contact signal from the tactile sensing unit and for adjusting a zero point of the scribing blade, and a switching unit connecting the tactile sensing unit to the zero point adjusting unit or the equipment stop unit.