Patents by Inventor Joung Sek Kwon

Joung Sek Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing coil unit in thin film type for compact actuator
    Patent number: 10186375
    Abstract: Provided is a method of manufacturing a coil unit in a thin film type for a compact actuator, and more particularly, a method of manufacturing a coil unit in a thin film type for a compact actuator in which a buffer layer is formed on a coil layer to prevent cracks in the coil layer and a substrate. According to the method of manufacturing the coil unit in a thin film type for a compact actuator of the present invention, the buffer layer is formed on the coil layer so that an impact to the coil layer during a back-grinding process for thinning a substrate is absorbed, thereby preventing the substrate and the coil layer from breaking due to the back-grinding process and compensating for a difference of deformation between the coil unit and the substrate according to a difference of coefficients of thermal expansion.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: January 22, 2019
    Assignee: EneBrain Co., Ltd.
    Inventor: Joung Sek Kwon
  • METHOD OF MANUFACTURING COIL UNIT IN THIN FILM TYPE FOR COMPACT ACTUATOR
    Publication number: 20180182543
    Abstract: Provided is a method of manufacturing a coil unit in a thin film type for a compact actuator, and more particularly, a method of manufacturing a coil unit in a thin film type for a compact actuator in which a buffer layer is formed on a coil layer to prevent cracks in the coil layer and a substrate. According to the method of manufacturing the coil unit in a thin film type for a compact actuator of the present invention, the buffer layer is formed on the coil layer so that an impact to the coil layer during a back-grinding process for thinning a substrate is absorbed, thereby preventing the substrate and the coil layer from breaking due to the back-grinding process and compensating for a difference of deformation between the coil unit and the substrate according to a difference of coefficients of thermal expansion.
    Type: Application
    Filed: December 23, 2016
    Publication date: June 28, 2018
    Applicant: EneBrain Co., Ltd.
    Inventor: Joung Sek Kwon
  • METHOD OF MANUFACTURING COIL UNIT IN THIN FILM TYPE FOR COMPACT ACTUATOR
    Publication number: 20180019058
    Abstract: Provided is a method of manufacturing a coil unit in a thin film type for a compact actuator, and more particularly, a method of manufacturing a coil unit in a thin film type for a compact actuator in which a buffer layer is formed on a coil layer to prevent cracks in the coil layer and a substrate. According to the method of manufacturing the coil unit in a thin film type for a compact actuator of the present invention, the buffer layer is formed on the coil layer so that an impact to the coil layer during a back-grinding process for thinning a substrate is absorbed, thereby preventing the substrate and the coil layer from breaking due to the back-grinding process and compensating for a difference of deformation between the coil unit and the substrate according to a difference of coefficients of thermal expansion.
    Type: Application
    Filed: December 23, 2016
    Publication date: January 18, 2018
    Applicant: EneBrain Co., Ltd.
    Inventor: Joung Sek Kwon