Patents by Inventor Joy M. Barker

Joy M. Barker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8907439
    Abstract: A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: December 9, 2014
    Assignee: Sandia Corporation
    Inventors: Randolph R. Kay, David V. Campbell, Subhash L. Shinde, Jeffrey L. Rienstra, Darwin K. Serkland, Michael L. Holmes, Seethambal S. Mani, Joy M. Barker, Dahwey Chu, Thomas Gurrieri
  • Publication number: 20100147456
    Abstract: A system and method for bonding and unbonding of small objects using small adhesive particles. The system and method includes the use of a plurality of optical tweezers to manipulate objects to be bonded and adhesive particles suspended in a fluid. The objects to be bonded (or unbonded) and the adhesive particles are positioned by lower power optical tweezers and then an intense bonding optical tweezer is activated to cause the adhesive to join the objects together (or used to unbond objects).
    Type: Application
    Filed: February 12, 2010
    Publication date: June 17, 2010
    Inventors: David G. GRIER, Kosta Ladavac, Joy M. Barker
  • Patent number: 7678222
    Abstract: A system and method for bonding and unbonding of small objects using small adhesive particles. The system and method includes the use of a plurality of optical tweezers to manipulate objects to be bonded and adhesive particles suspended in a fluid. The objects to be bonded (or unbonded) and the adhesive particles are positioned by lower power optical tweezers and then an intense bonding optical tweezer is activated to cause the adhesive to join the objects together (or used to unbond objects).
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: March 16, 2010
    Assignees: The United States of America as represented by the Secretary of Commerce, The National Institute of Standards & Technology, New York University
    Inventors: David G. Grier, Kosta Ladavac, Joy M. Barker