Patents by Inventor Joy S. Bloom

Joy S. Bloom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5304413
    Abstract: Laminar structures of PVF and substantially amorphous resin such as PEKK, backfilled with injection molding resin, exhibit an excellent combination of physical and aesthetic properties.
    Type: Grant
    Filed: April 29, 1992
    Date of Patent: April 19, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Joy S. Bloom, Robert F. Davis
  • Patent number: 4996287
    Abstract: A thermoformable polyaryletherketone sheet of a thickness of about 625-5000 micrometers, having repeating units derived from diphenyl ether and terephthalyl and isophthalyl groups, especially a polyetherketoneketone in which the terephthalyl to isophthalyl isomer ratio is about 70:30 to 0:100, especially 60:40 to 50:50, which thermoformable sheet has a crystallinity of 5% of less, can be fabricated into three-dimensional articles such as, e.g., panels and ducts for aircraft interiors having good formability and mold replication.
    Type: Grant
    Filed: December 13, 1988
    Date of Patent: February 26, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Joy S. Bloom
  • Patent number: 4937135
    Abstract: A thermoformable laminate comprising (1) a polyaryletherketone sheet having repeating units derived from diphenyl ether having attached to one of the phenyl rings either a 1,4-phenylenedicarbonyl group or a 1,3-phenylenedicarbonyl group, the ratio of 1,4-phenylenedicarbonyl groups to 1,3-phenylenedicarbonyl groups being 70:30 to 0:100, preferably 60:40 to 0:100, especially 60:40 to 50:50, the sheet thickness being about 625-5000 micrometers, and (2) a polyvinyl fluoride film having a thickness of about 12.8 to 204 micrometers can be thermoformed at a temperature of about 160.degree.-200.degree. C., especially 170.degree.-195.degree. C. One important application of such thermoformable sheets is in fabricating three-dimensional panels for aircraft interiors.
    Type: Grant
    Filed: December 13, 1988
    Date of Patent: June 26, 1990
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Joy S. Bloom