Patents by Inventor Joyce J. M. Peternel

Joyce J. M. Peternel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Socket locator
    Patent number: 11831093
    Abstract: An apparatus includes a substrate, a frame, and a socket. The frame defines a slot. The frame is coupled to the substrate such that the slot is aligned with an attachment location on the substrate. The socket receives a first device. The socket aligns with the attachment location on the substrate when the socket is inserted in the slot.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: November 28, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Matthew J. Traverso, Sandeep Razdan, Joyce J. M. Peternel
  • Thermal packaging with fan out wafer level processing
    Patent number: 11756861
    Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: September 12, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Ashley J. M. Erickson, Matthew J. Traverso, Sandeep Razdan, Joyce J. M. Peternel, Aparna R. Prasad
  • SOCKET LOCATOR
    Publication number: 20220320765
    Abstract: An apparatus includes a substrate, a frame, and a socket. The frame defines a slot. The frame is coupled to the substrate such that the slot is aligned with an attachment location on the substrate. The socket receives a first device. The socket aligns with the attachment location on the substrate when the socket is inserted in the slot.
    Type: Application
    Filed: December 20, 2021
    Publication date: October 6, 2022
    Inventors: Matthew J. TRAVERSO, Sandeep RAZDAN, Joyce J. M. PETERNEL
  • THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
    Publication number: 20220278022
    Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.
    Type: Application
    Filed: May 12, 2022
    Publication date: September 1, 2022
    Inventors: Ashley J.M. ERICKSON, Matthew J. TRAVERSO, Sandeep RAZDAN, Joyce J. M. PETERNEL, Aparna R. PRASAD
  • Thermal packaging with fan out wafer level processing
    Patent number: 11373930
    Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: June 28, 2022
    Assignee: Cisco Technology, Inc.
    Inventors: Ashley J. M. Erickson, Matthew J. Traverso, Sandeep Razdan, Joyce J. M. Peternel, Aparna R. Prasad
  • Connection features for electronic and optical packaging
    Patent number: 11215775
    Abstract: An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: January 4, 2022
    Assignee: Cisco Technology, Inc.
    Inventors: Ashley J. Maker, Joyce J. M. Peternel, Sandeep Razdan, Matthew J. Traverso, Aparna R. Prasad
  • THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING
    Publication number: 20210305128
    Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.
    Type: Application
    Filed: March 31, 2020
    Publication date: September 30, 2021
    Inventors: Ashley J.M. ERICKSON, Matthew J. TRAVERSO, Sandeep RAZDAN, Joyce J.M. PETERNEL, Aparna R. PRASAD
  • CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING
    Publication number: 20210055489
    Abstract: An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.
    Type: Application
    Filed: August 19, 2019
    Publication date: February 25, 2021
    Inventors: Ashley J. MAKER, Joyce J. M. PETERNEL, Sandeep RAZDAN, Matthew J. TRAVERSO, Aparna R. PRASAD
  • Electromagnetic isolating ball spring
    Patent number: 9256039
    Abstract: A device including a port barrel, a ball spring, a first enclosure part, and a mounting plate disposed adjacent to the first enclosure part is disclosed. The mounting plate includes a mounting hole. The port barrel is arranged to extend through the mounting hole, and the ball spring is arranged between an inner surface of the mounting hole and an exterior surface of the port barrel.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: February 9, 2016
    Assignee: Cisco Technology, Inc.
    Inventors: Joyce J. M. Peternel, Yong M. Jeon