Patents by Inventor Joyce L.S. Tang

Joyce L.S. Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic discharge (ESD) protection for electronic devices using wire-bonding
    Patent number: 8514534
    Abstract: A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: August 20, 2013
    Assignee: International Business Machines Corporation
    Inventors: William T. Bandy, IV, Dylan J. Boday, Peter J. Golcher, Icko E. T. Iben, Sassan K. Shahidi, Joyce L. S. Tang
  • ELECTROSTATIC DISCHARGE (ESD) PROTECTION FOR ELECTRONIC DEVICES USING WIRE-BONDING
    Publication number: 20120019967
    Abstract: A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.
    Type: Application
    Filed: July 20, 2010
    Publication date: January 26, 2012
    Applicant: International Business Machines Corporation
    Inventors: William T. Bandy, IV, Dylan J. Boday, Peter J. Golcher, Icko E.T. Iben, Sassan K. Shahidi, Joyce L.S. Tang