Abstract: A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.

Abstract: A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.

Abstract: A position detecting system detects and responds to the movement of a target through a sensing domain area of a plane. The movement causes the amount of the target that lies within a first sensing domain area of a first sensor to change. A second sensor detects a height from the plane to a sensor for enhancing accuracy of measurements from the first sensor.

Abstract: For isolation barrier with magnetics, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also described.

Abstract: A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.

Abstract: For isolation barrier with magnetics, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also described.

Abstract: Methods and apparatus for isolation barrier with magnetics. In an example arrangement, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also disclosed.

Abstract: A position sensor includes a target having an electrical conductor having an exterior boundary, a void located at least partially within the conductor, and an opening extending between the exterior boundary of the conductor and the void, wherein the opening interrupts a current path in the conductor around the void.

Abstract: A transformer for module integration includes a first layer of magnetic material having an outer edge, a second layer of magnetic material having an outer edge, and an isolation layer positioned between the first layer of magnetic material and the second layer of magnetic material along a primary axis. The transformer includes a first inductive element positioned in the first layer of magnetic material and a second inductive element disposed opposite of the first inductive element and in the second layer of magnetic material.

Abstract: Methods and apparatus for isolation barrier with magnetics. In an example arrangement, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also disclosed.

Abstract: A position sensor includes a target having an electrical conductor having an exterior boundary, a void located at least partially within the conductor, and an opening extending between the exterior boundary of the conductor and the void, wherein the opening interrupts a current path in the conductor around the void.

Abstract: A position detecting system detects and responds to the movement of a target through a sensing domain area of a plane. The movement causes the amount of the target that lies within a first sensing domain area of a first sensor to change. A second sensor detects a height from the plane to a sensor for enhancing accuracy of measurements from the first sensor.