Patents by Inventor Joyce Yamamoto

Joyce Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10471266
    Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO2, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: November 12, 2019
    Assignees: MEDTRONIC, INC., KYOCERA CORPORATION
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 9627833
    Abstract: A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: April 18, 2017
    Assignee: MEDTRONIC, INC.
    Inventors: Tom Miltich, Joyce Yamamoto, Andy Thom, Markus Reiterer, Gordon Munns, Mark Breyen
  • Publication number: 20160317821
    Abstract: A method of manufacturing an implantable medical device includes manufacturing a hermetic feedthrough by providing a first sheet of unfired ceramic material, forming one or more holes through the sheet, inserting a first conductive material into one of the holes, and forming a pad in electrical contact with the first conductive material in one of the holes, wherein the pad comprises a plurality of layers and has a thickness of at least 50 micrometers, at least one layer comprising a second conductive material having a different composition than the first conductive material. The method further includes co-firing the unfired ceramic material, the first conductive material, and the second conductive material. The method further includes coupling the feedthrough to an encasement structure of the implantable medical device.
    Type: Application
    Filed: July 12, 2016
    Publication date: November 3, 2016
    Applicants: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 9418778
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: August 16, 2016
    Assignees: MEDTRONIC, INC., KYOCERA CORPORATION
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 9008779
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: April 14, 2015
    Assignees: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 8872035
    Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: October 28, 2014
    Assignees: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto, Takahito Hirata
  • Publication number: 20140305694
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
    Type: Application
    Filed: March 10, 2014
    Publication date: October 16, 2014
    Applicants: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 8841558
    Abstract: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: September 23, 2014
    Assignees: Medtronic Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Publication number: 20140151114
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.
    Type: Application
    Filed: February 7, 2014
    Publication date: June 5, 2014
    Applicants: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 8670829
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: March 11, 2014
    Assignees: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 8588916
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: November 19, 2013
    Assignee: Medtronic, Inc.
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 8373075
    Abstract: A multilayered feedthrough for an implantable medical device includes a substrate having a first edge, a second edge, and a substrate length. A plurality of traces is formed on the substrate and extends along the substrate length. The plurality of traces extends to the first and second edges of the substrate. An insulator layer is formed on the substrate and the plurality of traces. A ground plane layer is formed on the insulator layer.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: February 12, 2013
    Assignee: Medtronic, Inc.
    Inventors: Gordon Orvis Munns, Greg Haubrich, David B. Engmark, Joyce Yamamoto, Simon Goldman, William Michael Brosnan, Brad Conrad Tischendorf, Andrew Jason Thom
  • Publication number: 20130032378
    Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 7, 2013
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto, Takahito Hirata
  • Publication number: 20130035732
    Abstract: A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Tom Miltich, Joyce Yamamoto, Andy Thom, Markus Reiterer, Gordon Munns, Mark Breyen
  • Publication number: 20130032382
    Abstract: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Publication number: 20130032391
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Publication number: 20130032392
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Publication number: 20110102967
    Abstract: A multilayered feedthrough for an implantable medical device includes a substrate having a first edge, a second edge, and a substrate length. A plurality of traces is formed on the substrate and extends along the substrate length. The plurality of traces extends to the first and second edges of the substrate. An insulator layer is formed on the substrate and the plurality of traces. A ground plane layer is formed on the insulator layer.
    Type: Application
    Filed: October 29, 2009
    Publication date: May 5, 2011
    Applicant: MEDTRONIC, INC.
    Inventors: Gordon Orvis Munns, Greg Haubrich, David B. Engmark, Joyce Yamamoto, Simon Goldman, William Michael Brosnan, Brad Conrad Tischendorf, Andrew Jason Thom
  • Publication number: 20070236861
    Abstract: A hermetic interconnect for implantable medical devices is presented. In one embodiment, the hermetic interconnect includes a conductive material introduced to a via in a single layer. The conductive material includes a first end and a second end. A first bonding pad is coupled to the first end of the conductive material. A second bonding pad is coupled to the second end of the conductive material. The single layer and the conductive material undergo a co-firing process.
    Type: Application
    Filed: April 5, 2006
    Publication date: October 11, 2007
    Inventors: Jeremy Burdon, Joyce Yamamoto, Lea Nygren, William Wolf
  • Publication number: 20070179554
    Abstract: An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 2, 2007
    Inventors: Rajesh lyer, Daniel Koch, Simon Goldman, Shawn Knowles, William Taylor, Joyce Yamamoto, Gregory Haubrich, Michael Nowak, David Nghiem, Roger Hubing, Len Twetan