Patents by Inventor Joycelyn O. Simpson

Joycelyn O. Simpson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6734603
    Abstract: A method for forming ferroelectric wafers is provided. A prestress layer is placed on the desired mold. A ferroelectric wafer is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may include reinforcing material and the ferroelectric wafer may include electrodes or electrode layers may be placed on either side of the ferroelectric layer. Wafers produced using this method have greatly improved output motion.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: May 11, 2004
    Assignee: The United States of America as represented by the National Aeronautics and Space Administration
    Inventors: Richard F. Hellbaum, Robert G. Bryant, Robert L. Fox, Antony Jalink, Jr., Wayne W. Rohrbach, Joycelyn O. Simpson
  • Patent number: 6379809
    Abstract: A thermally stable, piezoelectric and pyroelectric polymeric substrate was prepared. This thermally stable, piezoelectric and pyroelectric polymeric substrate may be used to prepare electromechanical transducers, thermomechanical transducers, accelerometers, acoustic sensors, infrared sensors, pressure sensors, vibration sensors, impact sensors, in-situ temperature sensors, in-situ stress/strain sensors, micro actuators, switches, adjustable fresnel lenses, speakers, tactile sensors, weather sensors, micro positioners, ultrasonic devices, power generators, tunable reflectors, microphones, and hydrophones. The process for preparing these polymeric substrates includes: providing a polymeric substrate having a softening temperature greater than 100° C.
    Type: Grant
    Filed: August 18, 1998
    Date of Patent: April 30, 2002
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Joycelyn O. Simpson, Terry L. St. Clair
  • Publication number: 20010043027
    Abstract: A method for forming ferroelectric wafers is provided. A prestress layer is placed on the desired mold. A ferroelectric wafer is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may include reinforcing material and the ferroelectric wafer may include electrodes or electrode layers may be placed on either side of the ferroelectric layer. Wafers produced using this method have greatly improved output motion.
    Type: Application
    Filed: January 24, 1997
    Publication date: November 22, 2001
    Inventors: RICHARD F. HELLBAUM, ROBERT G. BRYANT, ROBERT L. FOX, ANTONY JALINK, WAYNE W. ROHRBACH, JOYCELYN O. SIMPSON
  • Patent number: 5909905
    Abstract: A thermally stable, piezoelectric and pyroelectric polymeric substrate was prepared. This thermally stable, piezoelectric and pyroelectric polymeric substrate may be used to prepare electromechanical transducers, thermomechanical transducers, accelerometers, acoustic sensors, infrared sensors, pressure sensors, vibration sensors, impact sensors, in-situ temperature sensors, in-situ stress/strain sensors, micro actuators, switches, adjustable fresnel lenses, speakers, tactile sensors, weather sensors, micro positioners, ultrasonic devices, power generators, tunable reflectors, microphones, and hydrophones. The process for preparing these polymeric substrates includes: providing a polymeric substrate having a softening temperature greater than 100.degree. C.
    Type: Grant
    Filed: August 30, 1996
    Date of Patent: June 8, 1999
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Joycelyn O. Simpson, Terry L. St. Clair
  • Patent number: 5891581
    Abstract: A thermally stable, piezoelectric and pyroelectric polymeric substrate was prepared. This thermally stable, piezoelectric and pyroelectric polymeric substrate may be used to prepare electromechanical transducers, thermomechanical transducers, accelerometers, acoustic sensors, infrared sensors, pressure sensors, vibration sensors, impact sensors, in-situ temperature sensors, in-situ stress/strain sensors, micro actuators, switches, adjustable fresnel lenses, speakers, tactile sensors, weather sensors, micro positioners, ultrasonic devices, power generators, tunable reflectors, microphones, and hydrophones. The process for preparing these polymeric substrates includes: providing a polymeric substrate having a softening temperature greater than 100.degree. C.
    Type: Grant
    Filed: September 7, 1995
    Date of Patent: April 6, 1999
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Joycelyn O. Simpson, Terry L. St. Clair