Abstract: Embodiments of methods and system for transferring semiconductor devices from a wafer to a carrier structure are described. In one embodiment, a method for transferring semiconductor devices from a wafer to a carrier structure involves positioning a carrier structure with a bond surface extending in a first plane and transferring a semiconductor device from a wafer onto the bond surface of the carrier structure using a plurality of rotatable transfer assemblies. Centers of the rotatable transfer assemblies are positioned in parallel with the first plane.

Abstract: A positioning system and method for positioning a semiconductor device are disclosed. In an embodiment, a positioning system for positioning a semiconductor device includes a long-stroke stage configured to be movable with respect to a supporting structure within a plane and a short-stroke stage attached to the long-stroke stage and configured to carry a semiconductor device and to be rotatable within the plane. The long-stroke stage acts as a balance mass between the short-stroke stage and the supporting structure.

Abstract: A die expansion tool and method for expanding foil of a foil carrier connected to a frame is disclosed. In the embodiment, the die expansion tool has an inner body within a cavity formed by an outer body. The frame of the foil carrier can be positioned within the outer body and a wafer attached to the foil of the foil carrier can be positioned over the inner body. A pressurized fluid system, also within the cavity of the outer body, is positioned such that the pressurized fluid system can move the frame axially around the inner body and expand the foil.

Abstract: A positioning system and method for positioning a semiconductor device are disclosed. In an embodiment, a positioning system for positioning a semiconductor device includes a long-stroke stage configured to be movable with respect to a supporting structure within a plane and a short-stroke stage attached to the long-stroke stage and configured to carry a semiconductor device and to be rotatable within the plane. The long-stroke stage acts as a balance mass between the short-stroke stage and the supporting structure.

Abstract: Embodiments of methods and system for transferring semiconductor devices from a wafer to a carrier structure are described. In one embodiment, a method for transferring semiconductor devices from a wafer to a carrier structure involves positioning a carrier structure with a bond surface extending in a first plane and transferring a semiconductor device from a wafer onto the bond surface of the carrier structure using a plurality of rotatable transfer assemblies. Centers of the rotatable transfer assemblies are positioned in parallel with the first plane.

Abstract: A die expansion tool and method for expanding foil of a foil carrier connected to a frame is disclosed. In the embodiment, the die expansion tool has an inner body within a cavity formed by an outer body. The frame of the foil carrier can be positioned within the outer body and a wafer attached to the foil of the foil carrier can be positioned over the inner body. A pressurized fluid system, also within the cavity of the outer body, is positioned such that the pressurized fluid system can move the frame axially around the inner body and expand the foil.