Abstract: In the known method, a semiconductor element (1) is provided with two connecting conductors (2, 3) by arranging, preferably a large number of elements (1) between first and a second conductive plate (5, 6), the two connecting conductors (2, 3) secured at the upper surface and lower surface of an element (1) being formed from the two plates (5, 6). The first connecting conductor (5) is formed from a part (2) of the first plate (5) which borders on an opening (7), and the element (1) is covered with a protective envelope (4). The known method has the drawback that the devices obtained are not always directly suitable for surface mounting. Furthermore, the reliability of the device is sub-optimal.

Abstract: The invention relates to a method of manufacturing semiconductor devices in which a slice of semiconductor material is provided with a pn junction aligned parallel to the main surfaces of the slice. After the pn junctions is provided, depressions are provided in one main surface. These depressions cut through the pn junction, thereby dividing the main pn junction into mutually insulated pn junction portions. Before the slice is split up into separate semiconductor bodies, a layer of insulating material is provided. This method of manufacturing semiconductor devices allows for a simple application of the insulating layer to the walls of the depressions.