Patents by Inventor JR-Cheng Yeh

JR-Cheng Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • REDUCED LIGHT REFLECTION PACKAGE
    Publication number: 20240015447
    Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
    Type: Application
    Filed: September 22, 2023
    Publication date: January 11, 2024
    Inventors: Roberto Brioschi, Kazunori Hayata, Jr-Cheng Yeh, Dinesh Kumar Solanki
  • Reduced light reflection package
    Patent number: 11800297
    Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: October 24, 2023
    Assignee: InvenSense, Inc.
    Inventors: Roberto Brioschi, Kazunori Hayata, JR-Cheng Yeh, Dinesh Kumar Solanki
  • REDUCED LIGHT REFLECTION PACKAGE
    Publication number: 20220191624
    Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
    Type: Application
    Filed: October 5, 2021
    Publication date: June 16, 2022
    Inventors: Roberto Brioschi, Kazunori Hayata, JR-Cheng Yeh, Dinesh Kumar Solanki