Patents by Inventor Jr-Peng Ni

Jr-Peng Ni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7358540
    Abstract: An organic adhesive light-emitting device with an ohmic metal contact, including a conductive substrate having a first surface and a second surface over the upper surface, a light-emitting stack layer, an ohmic metal bulge formed over the first surface of the conductive substrate, a reflection layer formed over the light-emitting stack layer, a first reaction layer formed over the ohmic metal bulge and the second surface of the conductive substrate, a second reaction layer formed over the reflection layer, and an organic adhesive material. The reaction layer can punch through the organic adhesive material for forming the ohmic contact with the first reaction layer bonded to the second reaction layer by the organic adhesive material, and with the ohmic metal bulge.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: April 15, 2008
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Ya-Lan Yang, Ching-San Tao, Tzu-Feng Tseng, Jr-Peng Ni
  • Patent number: 7326967
    Abstract: The present invention is related to a light emitting diode of an omnidirectional reflector providing with a transparent conductive layer. In the present invention, a cohesion layer is formed between a transparent layer and a metal reflection layer to improve the cohesive force therebetween and increase the reflectivity of the light emitting diode, so as the present invention can enhance the light-emitting efficiency of the light emitting diode.
    Type: Grant
    Filed: July 8, 2005
    Date of Patent: February 5, 2008
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Ching-San Tao, Tzu-Feng Tseng, Jr-Peng Ni
  • Publication number: 20060006402
    Abstract: The present invention is related to a light emitting diode of an omnidirectional reflector providing with a transparent conductive layer. In the present invention, a cohesion layer is formed between a transparent layer and a metal reflection layer to improve the cohesive force therebetween and increase the reflectivity of the light emitting diode, so as the present invention can enhance the light-emitting efficiency of the light emitting diode.
    Type: Application
    Filed: July 8, 2005
    Publication date: January 12, 2006
    Inventors: Min-Hsun Hsieh, Ching-San Tao, Tzu-Feng Tseng, Jr-Peng Ni
  • Publication number: 20050167659
    Abstract: An organic adhesive light-emitting device with an ohmic metal contact, including a conductive substrate having a first surface and a second surface over the upper surface, a light-emitting stack layer, an ohmic metal bulge formed over the first surface of the conductive substrate, a reflection layer formed over the light-emitting stack layer, a first reaction layer formed over the ohmic metal bulge and the second surface of the conductive substrate, a second reaction layer formed over the reflection layer, and an organic adhesive material. The reaction layer can punch through the organic adhesive material for forming the ohmic contact with the first reaction layer bonded to the second reaction layer by the organic adhesive material, and with the ohmic metal bulge.
    Type: Application
    Filed: December 22, 2004
    Publication date: August 4, 2005
    Inventors: Min-Hsun Hsieh, Ya-Lan Yang, Ching-San Tao, Tzu-Feng Tseng, Jr-Peng Ni