Patents by Inventor Jr-Shuen Yang

Jr-Shuen Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding capillary for an image sensor
    Publication number: 20040211814
    Abstract: A wire bonding capillary includes a first column having a first end and a second end, a second column extending from the second end of the first column and having a circular cross-section with a diameter smaller than that of the first column, and a third column extending from the second column and formed with a funnel structure and a pointed wire-bonding end. The third column is positioned between a frame layer and a photosensitive chip of an image sensor to bond a plurality of wires to a photosensitive chip and a substrate of the image sensor.
    Type: Application
    Filed: April 23, 2003
    Publication date: October 28, 2004
    Inventors: Jackson Hsieh, Jichen Wu, Bruce Chen, Eric Chang, Worrell Tsai, Abnet Chen, Jr-Shuen Yang