Patents by Inventor Ju-An Lee

Ju-An Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096888
    Abstract: A super-steep switching device and an inverter device using the same are disclosed. The super-steep switching device includes a semiconductor channel disposed on a substrate and made of a semiconductor material having impact ionization characteristic; a source electrode and a drain electrode in contact with the semiconductor channel, wherein the source electrode and the drain electrode are disposed on the substrate and are spaced apart from each other; and a gate electrode disposed on the semiconductor channel so as to overlap only a portion of the semiconductor channel, wherein a top surface of the semiconductor channel includes a first area overlapping the gate electrode, and a second area non-overlapping the gate electrode, wherein a ratio of a length of the first area and a length of the second area is in a range of 1:0.1 to 0.4.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 21, 2024
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Hae Ju CHOI, Tae Ho KANG, Chan Woo KANG, Hyeon Je SON, Jin Hong PARK, Sung Joo LEE, Sung Pyo BAEK
  • Publication number: 20240093252
    Abstract: The present disclosure relates to an isopropylmalate synthase variant and a method of producing L-leucine using the same.
    Type: Application
    Filed: January 28, 2022
    Publication date: March 21, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Hayun LEE, Ju Eun KIM, Ji Hye LEE
  • Patent number: 11933809
    Abstract: The present application discloses an inertial sensor comprising a proof mass, an anchor, a flexible member and several sensing electrodes. The anchor is positioned on one side of the sensing, mass block in a first axis. The flexible member is connected to the anchor point and extends along the first axis towards the proof mass to connect the proof mass, in which the several sensing electrodes are provided. In this way, the present application can effectively solve the problems of high difficulty in the production and assembly of inertial sensors and poor product reliability thereof.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: March 19, 2024
    Assignee: SENSORTEK TECHNOLOGY CORP.
    Inventors: Shih-Wei Lee, Chia-Hao Lin, Shih-Hsiung Tseng, Kuan-Ju Tseng, Chao-Shiun Wang
  • Patent number: 11931324
    Abstract: Provided is a pharmaceutical composition for preventing or treating osteoarthritis, the pharmaceutical composition including, as an active ingredient, obtusifolin, a derivative thereof, or a pharmaceutically acceptable salt thereof. The composition according to an aspect inhibits cartilage destruction-promoting factors and alleviates inflammatory responses, thereby exhibiting significantly excellent effects for preventing or treating osteoarthritis.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: March 19, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Cheol-ho Pan, Kwang-hyun Cha, Song Yi Koo, Eun Ha Lee, Hee Ju Lee
  • Patent number: 11931489
    Abstract: A sterilization apparatus includes a main body, and a plurality of sterilization modules. The main body defines a sterilization space for sterilization of a sterilization target. The sterilization modules are disposed on a plurality of inner surfaces of the main body surrounding the sterilization space, respectively, and deliver germicidal light to the sterilization space. In addition, the sterilization module includes a support member and a plurality of light sources. A space between adjacent light sources disposed in some regions of the support member is different from a space between adjacent light sources disposed in the other regions of the support member.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: March 19, 2024
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Eun Ju Kim, Chung Hoon Lee, Jae Young Choi
  • Patent number: 11932895
    Abstract: The present disclosure relates to a composition for preparing hexanol or butanol and a method for preparing hexanol or butanol using ethanol and synthesis gas, wherein the composition according to an aspect of the present disclosure is a medium composition containing ethanol as an active ingredient, and by culturing a strain producing hexanol or butanol after inoculating with a medium containing the composition and supplying synthesis gas, hexanol or butanol can be prepared economically using inexpensive synthesis gas, and hexanol or butanol can be prepared with high efficiency by focusing the flow of a carbon source consumed in a fermentation process to the production of hexanol or butanol.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: March 19, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyun Ju Oh, Youngsoon Um, Sun Mi Lee, Gyeongtaek Gong, Ja Kyong Ko
  • Patent number: 11936029
    Abstract: A vehicular heat management system for individually cooling and heating a plurality of air conditioning regions of a vehicle includes a plurality of refrigerant circulation lines configured to cool and heat the air conditioning regions individually shared by the refrigerant circulation lines. The refrigerant circulation lines are provided with one or more air conditioning units for individually cooling and heating the respective air conditioning regions, and are configured to supply a refrigerant to the corresponding air conditioning units to individually cool and heat the air conditioning regions corresponding to the air conditioning units.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: March 19, 2024
    Assignee: Hanon Systems
    Inventors: Doo Hoon Kim, Hyeon Gyu Kim, Kyung Ju An, Jin Jae Lee, Joong Man Han
  • Publication number: 20240085760
    Abstract: An aperture module includes a reference plate, including a protruded pivot pin; a first-stage blade unit including a pair of first blades forming a first-diameter aperture having a diameter smaller than that of the central opening when pivoted about the pivot pin; a second-stage blade unit including a pair of second blades, wherein the second-stage blade unit is disposed on a second planar surface different from a first planar surface of the first-stage blade unit, and the pair of second blades forms a second-diameter aperture having a diameter smaller than the diameter of the first-diameter aperture when pivoted about the pivot pin; and an aperture driver including a driving pin configured to insert into the guide slot, the first blade slot, and the second blade slot, and move along the guide slot. A curvature of the first blade slot and a curvature of the second blade slot form different angles.
    Type: Application
    Filed: February 22, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Ho KIM, Sanghyun JI, Dooseub SHIN, Donghoon LEE, Dohwan KIM, Jongeun PARK
  • Publication number: 20240085777
    Abstract: Provided is a process proximity effect correction method capable of efficiently improving the dispersion of patterns. There is a process proximity effect correction method according to some embodiments, the process proximity effect correction method of a process proximity effect correction device for performing process proximity effect correction (PPC) of a plurality of patterns using a machine learning module executed by a processor, comprising: training a sensitivity model by inputting a layout image of the plurality of patterns and a layout critical dimension (CD) of the plurality of patterns into the machine learning module; estimating an after cleaning inspection critical dimension (ACI-CD) sensitivity prediction value of the plurality of patterns by inferring an ACI-CD prediction value of the plurality of patterns; and determining a correction rate of the layout CD of the plurality of patterns using the estimated sensitivity prediction value.
    Type: Application
    Filed: May 31, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dae Young PARK, Jeong Hoon KO, Seong Ryeol KIM, Young-Gu KIM, Tae Hoon KIM, Hyun Joong KIM, Young Ju LEE
  • Publication number: 20240085788
    Abstract: An object of the present disclosure is to improve display reliability and lifetime as well as vivid colors. When there remain residues in the washing part due to incomplete removal during the developing step, it can cause dark spots or pixel off due to the residues, and thus residue-free pixels can be formed by optimizing the temperature and time for developing. Additionally, when the amount of outgas in the panel after post-baking is 15 ppm or more, it may cause a reduction in luminance and lifetime due to pixel shrinkage. Therefore, in order to minimize the amount of outgas after completion of the post-baking process, the generation of outgas in the panel state can be minimized by generating sufficient fume in the post-baking step, in addition to forming clean pixels in the developing step.
    Type: Application
    Filed: August 16, 2023
    Publication date: March 14, 2024
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Jun BAE, Changmin LEE, Yeon Soo LEE, Jun Ki KIM, Jin Hyun KIM, Ju Cheol KWON, Soung Yun MUN, Kyung Soo KIM
  • Publication number: 20240086603
    Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: In HUH, Jeong-hoon KO, Hyo-jin CHOI, Seung-ju KIM, Chang-wook JEONG, Joon-wan CHAI, Kwang-II PARK, Youn-sik PARK, Hyun-sun PARK, Young-min OH, Jun-haeng LEE, Tae-ho LEE
  • Publication number: 20240085188
    Abstract: An apparatus for localizing a robot having robustness to a dynamic environment includes a map building unit which builds a map based on SLAM; a localizing unit which acquires first feature from sensor data acquired by a sensor mounted in a robot and localizes the robot using the first feature acquired from the sensor data based on the map built by the map building unit; and a map updating unit which reduces an error caused by the movement of the robot by correcting the first feature using an estimated position of the robot with regard to a feature obtained from a static object, among the first features acquired by the localizing unit.
    Type: Application
    Filed: May 11, 2023
    Publication date: March 14, 2024
    Inventors: Seong Ju PARK, Jin Baek KIM, Jae Young LEE
  • Publication number: 20240090324
    Abstract: The present disclosure relates to a plurality of host materials, an organic electroluminescent compound, and an organic electroluminescent device comprising the same. An organic electroluminescent device having improved driving voltage, luminous efficiency, and/or lifespan properties compared to a conventional organic electroluminescent device can be provided by including the specific combination of compounds according to the present disclosure as a plurality of host materials or by including the compound according to the present disclosure.
    Type: Application
    Filed: July 18, 2023
    Publication date: March 14, 2024
    Inventors: Hyo-Jung LEE, Yea-Mi SONG, Hyun-Ju KANG, Mi-Ja LEE, Doo-Hyeon MOON, Kyoung-Jin PARK, Du-Yong PARK, DaiKyu KIM
  • Publication number: 20240088022
    Abstract: Some embodiments relate to an integrated chip including a plurality of conductive structures over a substrate. A first dielectric layer is disposed laterally between the conductive structures. A spacer structure is disposed between the first dielectric layer and the plurality of conductive structures. An etch stop layer overlies the plurality of conductive structures. The etch stop layer is disposed on upper surfaces of the spacer structure and the first dielectric layer.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Yu-Teng Dai, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Hsi-Wen Tien, Wei-Hao Liao
  • Publication number: 20240088432
    Abstract: An embodiment sulfur dioxide-based inorganic electrolyte is provided in which the sulfur dioxide-based inorganic electrolyte is represented by a chemical formula M·(A1·Cl(4-x)Fx)z·ySO2. In this formula, M is a first element selected from the group consisting of Li, Na, K, Ca, and Mg, A1 is a second element selected from the group consisting of Al, Fe, Ga, and Cu, x satisfies a first equation 0?x?4, y satisfies a second equation 0?y?6, and z satisfies a third equation 1?z?2.
    Type: Application
    Filed: April 12, 2023
    Publication date: March 14, 2024
    Inventors: Kyu Ju Kwak, Won Keun Kim, Eun Ji Kwon, Samuel Seo, Yeon Jong Oh, Kyoung Han Ryu, Dong Hyun Lee, Han Su Kim, Ji Whan Lee, Seong Hoon Choi, Seung Do Mun
  • Publication number: 20240087980
    Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.
    Type: Application
    Filed: February 17, 2023
    Publication date: March 14, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kai-Fang CHENG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Yen-Ju WU, Yen-Pin HSU, Li-Ling SU, Ming-Hsien LIN, Hsiao-Kang CHANG
  • Publication number: 20240090326
    Abstract: The present disclosure relates to an organic compound having the following structure, and an organic light emitting diode (OLED) and an organic light emitting device including the organic compound. The organic compound can be a bipolar compound having a p-type moiety and an n-type moiety and has high energy level and proper energy bandgap for an emissive layer of the OLED. As the organic compound is applied into the emissive layer, the OLED can maximize its luminous properties as holes and electrons are recombined uniformly over the whole area in an emitting material layer (EML).
    Type: Application
    Filed: September 26, 2023
    Publication date: March 14, 2024
    Applicants: LG DISPLAY CO., LTD, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Kyung-Jin YOON, Dae-Wi YOON, Ji-Ae LEE, Su-Na CHOI, Dong-Hoon CHOI, Min-Ju CHO, JiWon YOON
  • Patent number: 11929498
    Abstract: A silicon-carbon complex comprising carbon-based particles and silicon-based particles, wherein the silicon-based particles are dispersed and positioned on surfaces of the carbon-based particles, the carbon-based particles have a specific surface area of 0.4 m2/g to 1.5 m2/g, and the silicon-based particles are doped with one or more elements selected from the group consisting of Mg, Li, Ca, and Al, and a negative electrode active material for lithium secondary battery comprising the same.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: March 12, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Su Min Lee, Eun Kyung Kim, Yong Ju Lee, Rae Hwan Jo, Dong Hyuk Kim, Se Mi Park
  • Patent number: 11929258
    Abstract: An integrated circuit structure includes a first metal feature formed into a first dielectric layer, a second metal feature formed into a second dielectric layer, the second dielectric layer being disposed on said first dielectric layer, and a via connecting the first metal feature to the second metal feature, wherein a top portion of the via is offset from a bottom portion of the via.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Ming Chang, Chih-Ming Lai, Ru-Gun Liu, Tsai-Sheng Gau, Chung-Ju Lee, Tien-I Bao, Shau-Lin Shue
  • Patent number: D1017742
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: March 12, 2024
    Assignee: Cobra Golf Incorporated
    Inventors: Ang-Ju Lee, Christopher G. Engel, Cameron J. Day, Douglas E. Roberts, Sean Tang