Patents by Inventor Ju-bong Kim

Ju-bong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210166158
    Abstract: The present disclosure relates to a system and method for controlling multiple devices through a federated reinforcement learning, in more detail, in case of performing the reinforcement learnings for controlling each of a plurality of devices in each of the plurality of devices, provided a system and method for controlling multiple devices through the federated reinforcement learning to be able to precisely control the plurality of devices using the reinforcement learning result as well as to finish the reinforcement learning at high speed, by performing a coalition of the reinforcement learning in the plurality of device controllers, through a gradient sharing process shared with the plurality of device controllers by averaging the gradients for each of the reinforcement learnings and a learning parameter transfer process transferring the learning parameter of a particular device controller that a reinforcement learning is terminated first through the gradient sharing process to at least one device controll
    Type: Application
    Filed: November 13, 2020
    Publication date: June 3, 2021
    Inventors: Youn Hee HAN, Hyun Kyo LIM, Chan Myung KIM, Ju Bong KIM, Gyu Young HWANG, Ho Bin CHOI
  • Patent number: 6150713
    Abstract: A lead frame plating method including the steps of (a) forming an intermediate layer on the upper surface of a metal substrate, (b) submerging the metal substrate into a plating solution, and (c) forming a passive layer to a thickness of 0.01 to 1.5 microinches on the upper surface of the intermediate layer by applying a modulated current to the plating solution and the metal substrate.
    Type: Grant
    Filed: March 2, 1999
    Date of Patent: November 21, 2000
    Assignee: Samsung Aerospace Industries, Ltd.
    Inventors: Se-chul Park, Kyu-han Lee, Ju-bong Kim, Sung-il Kang, Dong-il Shin, Bae-soon Jang