Abstract: Proposed are an organic solvent supplying apparatus, a substrate processing method, and a substrate processing apparatus. An organic solvent supplying apparatus according to an embodiment supplies an organic solvent to a liquid processing chamber of a substrate processing apparatus, the substrate processing apparatus including the liquid processing chamber for supplying the organic solvent to a substrate and a supercritical processing chamber for drying the substrate coated with the organic solvent using supercritical fluid. The organic solvent supplying apparatus includes a supply tank for storing the organic solvent, a supply line connected to the supply tank and the liquid processing chamber, and a cooling module provided on the supply line.

Abstract: The present disclosure relates to a system and method for controlling multiple devices through a federated reinforcement learning, in more detail, in case of performing the reinforcement learnings for controlling each of a plurality of devices in each of the plurality of devices, provided a system and method for controlling multiple devices through the federated reinforcement learning to be able to precisely control the plurality of devices using the reinforcement learning result as well as to finish the reinforcement learning at high speed, by performing a coalition of the reinforcement learning in the plurality of device controllers, through a gradient sharing process shared with the plurality of device controllers by averaging the gradients for each of the reinforcement learnings and a learning parameter transfer process transferring the learning parameter of a particular device controller that a reinforcement learning is terminated first through the gradient sharing process to at least one device controll

Abstract: A lead frame plating method including the steps of (a) forming an intermediate layer on the upper surface of a metal substrate, (b) submerging the metal substrate into a plating solution, and (c) forming a passive layer to a thickness of 0.01 to 1.5 microinches on the upper surface of the intermediate layer by applying a modulated current to the plating solution and the metal substrate.