Patents by Inventor Ju-Chen Chiu
Ju-Chen Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10369827Abstract: A transfer film including a substrate, a protection layer, a metal coating layer, and an ink layer is provided. The substrate has a first surface and a second surface, and the first surface has a first stereoscopic pattern. The protection layer is disposed on the substrate, and has a third surface and a fourth surface. The third surface contacts the first surface, and has a second stereoscopic pattern complementing the first stereoscopic pattern. The fourth surface has a third stereoscopic pattern. The metal coating layer is disposed on the protection layer, and has a fifth surface contacting the fourth surface and a sixth surface. The ink layer is disposed on the metal coating layer. The protection layer and the substrate are separated after transfer to expose the second stereoscopic pattern and reflect out the third stereoscopic pattern. A manufacturing method of the transfer film is also provided.Type: GrantFiled: October 11, 2017Date of Patent: August 6, 2019Assignee: COMPAL ELECTRONICS, INC.Inventors: Ju-Chen Chiu, Po-An Lin, Chih-Hua Liu
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Publication number: 20190054750Abstract: A transfer film including a substrate, a protection layer, a metal coating layer, and an ink layer is provided. The substrate has a first surface and a second surface, and the first surface has a first stereoscopic pattern. The protection layer is disposed on the substrate, and has a third surface and a fourth surface. The third surface contacts the first surface, and has a second stereoscopic pattern complementing the first stereoscopic pattern. The fourth surface has a third stereoscopic pattern. The metal coating layer is disposed on the protection layer, and has a fifth surface contacting the fourth surface and a sixth surface. The ink layer is disposed on the metal coating layer. The protection layer and the substrate are separated after transfer to expose the second stereoscopic pattern and reflect out the third stereoscopic pattern. A manufacturing method of the transfer film is also provided.Type: ApplicationFiled: October 11, 2017Publication date: February 21, 2019Applicant: COMPAL ELECTRONICS, INC.Inventors: Ju-Chen Chiu, Po-An Lin, Chih-Hua Liu
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Publication number: 20180264873Abstract: A decorative film structure includes a foamed resin layer and a protective resin layer. The protective resin layer is disposed on the foamed resin layer and has a stereoscopic patterned surface relatively far from the foamed resin layer. A manufacturing method of the decorative film structure is also provided.Type: ApplicationFiled: March 14, 2018Publication date: September 20, 2018Applicant: COMPAL ELECTRONICS, INC.Inventors: Ju-Chen Chiu, Po-An Lin, Sheng-Hung Lee, Kuo-Nan Ling, Chih-Hua Liu
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Patent number: 9242505Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.Type: GrantFiled: November 24, 2011Date of Patent: January 26, 2016Assignee: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
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Patent number: 8911581Abstract: A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.Type: GrantFiled: June 11, 2013Date of Patent: December 16, 2014Assignee: Compal Electronics, Inc.Inventors: Ju-Chen Chiu, Chien-Min Chang, Po-An Lin, Chih-Hua Liu, Hao-Ying Chang
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Publication number: 20140116607Abstract: A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.Type: ApplicationFiled: June 11, 2013Publication date: May 1, 2014Inventors: Ju-Chen CHIU, Chien-Min CHANG, Po-An LIN, Chih-Hua LIU, Hao-Ying CHANG
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Patent number: 8684579Abstract: An electronic device includes a display module, a base and a keyboard module. The display module is pivoted on the base. The keyboard module is disposed on the base. The keyboard module has a plurality of keys. Each of the keys includes a main body and an imprinted structure. The main body has a top surface. The imprinted structure is disposed on the top surface of the main body and includes a light guiding portion and a light scattering portion. A light emitted by the display module illuminates the keyboard module. The light is guided towards a specific direction when the light passes through the light guiding portion, and the light is scattered in other directions when the light passes through the light scattering portion.Type: GrantFiled: May 22, 2012Date of Patent: April 1, 2014Assignee: Compal Electronics, Inc.Inventors: Wan-Li Chuang, Chien-Min Chang, Li-Jung Yu, Mei-Hsiung Tsai, Yung-Ching Chang, Ju-Chen Chiu
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Publication number: 20130265799Abstract: An electronic device includes a display module, a base and a keyboard module. The display module is pivoted on the base. The keyboard module is disposed on the base. The keyboard module has a plurality of keys. Each of the keys includes a main body and an imprinted structure. The main body has a top surface. The imprinted structure is disposed on the top surface of the main body and includes a light guiding portion and a light scattering portion. A light emitted by the display module illuminates the keyboard module. The light is guided towards a specific direction when the light passes through the light guiding portion, and the light is scattered in other directions when the light passes through the light scattering portion.Type: ApplicationFiled: May 22, 2012Publication date: October 10, 2013Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Li-Jung Yu, Mei-Hsiung Tsai, Yung-Ching Chang, Ju-Chen Chiu
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Patent number: 8377540Abstract: A transfer film including a protection layer and a substrate is provided. The substrate has a first surface with a first three-dimensional pattern and a second surface. The first three-dimensional pattern has at least one protrusion portion or at least one recess portion. The protection layer is disposed on the substrate and has a third surface and a fourth surface. The third surface contacts the first surface and has a second three-dimensional pattern complementary to the first three-dimensional pattern. The second three-dimensional pattern of the third surface is formed by covering the first three-dimensional pattern of the first surface. The protection layer and the substrate are separated after transfer, so as to expose the second three-dimensional pattern.Type: GrantFiled: October 20, 2009Date of Patent: February 19, 2013Assignee: Compal Electronics, Inc.Inventors: Ju-Chen Chiu, Yin Ta Chen
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Publication number: 20120070639Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.Type: ApplicationFiled: November 24, 2011Publication date: March 22, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
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Publication number: 20100163173Abstract: Disclosed herein is a heat bonding film, which includes a hot-melt adhesive film and a protective layer disposed on the hot-melt adhesive film. The hot-melt adhesive film exhibits an adhesive property after being heated. While an outer surface of the protective layer is heated, the heat bonding film may be attached onto an object through the adhesive property provided by the hot-melt adhesive film.Type: ApplicationFiled: December 24, 2009Publication date: July 1, 2010Inventor: Ju-Chen CHIU
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Publication number: 20100104807Abstract: A transfer film including a protection layer and a substrate is provided. The substrate has a first surface with a first three-dimensional pattern and a second surface. The first three-dimensional pattern has at least one protrusion portion or at least one recess portion. The protection layer is disposed on the substrate and has a third surface and a fourth surface. The third surface contacts the first surface and has a second three-dimensional pattern complementary to the first three-dimensional pattern. The second three-dimensional pattern of the third surface is formed by covering the first three-dimensional pattern of the first surface. The protection layer and the substrate are separated after transfer, so as to expose the second three-dimensional pattern.Type: ApplicationFiled: October 20, 2009Publication date: April 29, 2010Applicant: COMPAL ELECTRONICS, INC.Inventors: Ju-Chen Chiu, Yin Ta Chen