Patents by Inventor Ju-Chen Chiu

Ju-Chen Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10369827
    Abstract: A transfer film including a substrate, a protection layer, a metal coating layer, and an ink layer is provided. The substrate has a first surface and a second surface, and the first surface has a first stereoscopic pattern. The protection layer is disposed on the substrate, and has a third surface and a fourth surface. The third surface contacts the first surface, and has a second stereoscopic pattern complementing the first stereoscopic pattern. The fourth surface has a third stereoscopic pattern. The metal coating layer is disposed on the protection layer, and has a fifth surface contacting the fourth surface and a sixth surface. The ink layer is disposed on the metal coating layer. The protection layer and the substrate are separated after transfer to expose the second stereoscopic pattern and reflect out the third stereoscopic pattern. A manufacturing method of the transfer film is also provided.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: August 6, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ju-Chen Chiu, Po-An Lin, Chih-Hua Liu
  • Publication number: 20190054750
    Abstract: A transfer film including a substrate, a protection layer, a metal coating layer, and an ink layer is provided. The substrate has a first surface and a second surface, and the first surface has a first stereoscopic pattern. The protection layer is disposed on the substrate, and has a third surface and a fourth surface. The third surface contacts the first surface, and has a second stereoscopic pattern complementing the first stereoscopic pattern. The fourth surface has a third stereoscopic pattern. The metal coating layer is disposed on the protection layer, and has a fifth surface contacting the fourth surface and a sixth surface. The ink layer is disposed on the metal coating layer. The protection layer and the substrate are separated after transfer to expose the second stereoscopic pattern and reflect out the third stereoscopic pattern. A manufacturing method of the transfer film is also provided.
    Type: Application
    Filed: October 11, 2017
    Publication date: February 21, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ju-Chen Chiu, Po-An Lin, Chih-Hua Liu
  • Publication number: 20180264873
    Abstract: A decorative film structure includes a foamed resin layer and a protective resin layer. The protective resin layer is disposed on the foamed resin layer and has a stereoscopic patterned surface relatively far from the foamed resin layer. A manufacturing method of the decorative film structure is also provided.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 20, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ju-Chen Chiu, Po-An Lin, Sheng-Hung Lee, Kuo-Nan Ling, Chih-Hua Liu
  • Patent number: 9242505
    Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.
    Type: Grant
    Filed: November 24, 2011
    Date of Patent: January 26, 2016
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
  • Patent number: 8911581
    Abstract: A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: December 16, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Ju-Chen Chiu, Chien-Min Chang, Po-An Lin, Chih-Hua Liu, Hao-Ying Chang
  • Publication number: 20140116607
    Abstract: A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.
    Type: Application
    Filed: June 11, 2013
    Publication date: May 1, 2014
    Inventors: Ju-Chen CHIU, Chien-Min CHANG, Po-An LIN, Chih-Hua LIU, Hao-Ying CHANG
  • Patent number: 8684579
    Abstract: An electronic device includes a display module, a base and a keyboard module. The display module is pivoted on the base. The keyboard module is disposed on the base. The keyboard module has a plurality of keys. Each of the keys includes a main body and an imprinted structure. The main body has a top surface. The imprinted structure is disposed on the top surface of the main body and includes a light guiding portion and a light scattering portion. A light emitted by the display module illuminates the keyboard module. The light is guided towards a specific direction when the light passes through the light guiding portion, and the light is scattered in other directions when the light passes through the light scattering portion.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: April 1, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Li-Jung Yu, Mei-Hsiung Tsai, Yung-Ching Chang, Ju-Chen Chiu
  • Publication number: 20130265799
    Abstract: An electronic device includes a display module, a base and a keyboard module. The display module is pivoted on the base. The keyboard module is disposed on the base. The keyboard module has a plurality of keys. Each of the keys includes a main body and an imprinted structure. The main body has a top surface. The imprinted structure is disposed on the top surface of the main body and includes a light guiding portion and a light scattering portion. A light emitted by the display module illuminates the keyboard module. The light is guided towards a specific direction when the light passes through the light guiding portion, and the light is scattered in other directions when the light passes through the light scattering portion.
    Type: Application
    Filed: May 22, 2012
    Publication date: October 10, 2013
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Li-Jung Yu, Mei-Hsiung Tsai, Yung-Ching Chang, Ju-Chen Chiu
  • Patent number: 8377540
    Abstract: A transfer film including a protection layer and a substrate is provided. The substrate has a first surface with a first three-dimensional pattern and a second surface. The first three-dimensional pattern has at least one protrusion portion or at least one recess portion. The protection layer is disposed on the substrate and has a third surface and a fourth surface. The third surface contacts the first surface and has a second three-dimensional pattern complementary to the first three-dimensional pattern. The second three-dimensional pattern of the third surface is formed by covering the first three-dimensional pattern of the first surface. The protection layer and the substrate are separated after transfer, so as to expose the second three-dimensional pattern.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: February 19, 2013
    Assignee: Compal Electronics, Inc.
    Inventors: Ju-Chen Chiu, Yin Ta Chen
  • Publication number: 20120070639
    Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.
    Type: Application
    Filed: November 24, 2011
    Publication date: March 22, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
  • Publication number: 20100163173
    Abstract: Disclosed herein is a heat bonding film, which includes a hot-melt adhesive film and a protective layer disposed on the hot-melt adhesive film. The hot-melt adhesive film exhibits an adhesive property after being heated. While an outer surface of the protective layer is heated, the heat bonding film may be attached onto an object through the adhesive property provided by the hot-melt adhesive film.
    Type: Application
    Filed: December 24, 2009
    Publication date: July 1, 2010
    Inventor: Ju-Chen CHIU
  • Publication number: 20100104807
    Abstract: A transfer film including a protection layer and a substrate is provided. The substrate has a first surface with a first three-dimensional pattern and a second surface. The first three-dimensional pattern has at least one protrusion portion or at least one recess portion. The protection layer is disposed on the substrate and has a third surface and a fourth surface. The third surface contacts the first surface and has a second three-dimensional pattern complementary to the first three-dimensional pattern. The second three-dimensional pattern of the third surface is formed by covering the first three-dimensional pattern of the first surface. The protection layer and the substrate are separated after transfer, so as to expose the second three-dimensional pattern.
    Type: Application
    Filed: October 20, 2009
    Publication date: April 29, 2010
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ju-Chen Chiu, Yin Ta Chen